{"title":"High thermal stability of poly-Si nodes with novel CrTiN/TiN double barrier layers for high-density ferroelectric memory applications","authors":"J. Koo, S. Hong, S. Yeom, J. Roh, Jiyoung Kim","doi":"10.1109/IEDM.2001.979484","DOIUrl":null,"url":null,"abstract":"We propose a novel CrTiN/TiN double barrier layer technology for high-density COB structure applications. After furnace annealing at 800/spl deg/C for 30min, a 0.35/spl mu/m poly-Si contact test structure with the Pt/CrTiN/TiN layer was found to maintain ohmic behaviors and provide a resistance of about 1k/spl Omega/. In addition, these contact structures successfully exhibited long time thermal stability at 750/spl deg/C. The findings of this study suggest that the CrTiN/TiN double barrier layer method is suitable for the COB structure in order to realize high-density ferroelectric memory applications.","PeriodicalId":13825,"journal":{"name":"International Electron Devices Meeting. Technical Digest (Cat. No.01CH37224)","volume":"10 3 1","pages":"12.5.1-12.5.4"},"PeriodicalIF":0.0000,"publicationDate":"2001-12-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Electron Devices Meeting. Technical Digest (Cat. No.01CH37224)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM.2001.979484","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
We propose a novel CrTiN/TiN double barrier layer technology for high-density COB structure applications. After furnace annealing at 800/spl deg/C for 30min, a 0.35/spl mu/m poly-Si contact test structure with the Pt/CrTiN/TiN layer was found to maintain ohmic behaviors and provide a resistance of about 1k/spl Omega/. In addition, these contact structures successfully exhibited long time thermal stability at 750/spl deg/C. The findings of this study suggest that the CrTiN/TiN double barrier layer method is suitable for the COB structure in order to realize high-density ferroelectric memory applications.