Broadband PA Architectures with Asymmetrical Combining and Stacked PA cells across 50-70 GHz and 64-110 GHz in 250 nm InP

T. Sharma, Zheng Liu, C. R. Chappidi, H. Saeidi, S. Venkatesh, K. Sengupta
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引用次数: 10

Abstract

High-efficiency and broadband power amplifiers (PAs) are key to enabling the next-generation of millimeter-Wave (mm-Wave) systems and multi-functional communication, sensing and imaging arrays. Due to the low $f/f_{max}$, low breakdown voltages and low gain in silicon devices at mm-Wave frequencies, InP HBTs have been promising candidates to enable high-efficiency, high power and broadband transmitter frontends for compact phased and MIMO arrays above 50 GHz. In this paper, we present two broadband PA architectures covering 50–70 GHz, and 64–110 GHz in 250 nm InP HBT process through specially designed asymmetrical power combining architectures with stacked PA cells. The PAs generate more than 20 dBm of peak power in both the bands with peak output collector efficiency (ηout) exceeding 40%, total collector efficiency (η) exceeding 30% and peak power added efficiency (PAE) >23 % for both bands. This work presents one of the highest bandwidth and highest efficiency PAs with peak power greater than 20 dBm.
250 nm InP中50-70 GHz和64-110 GHz频段非对称组合和堆叠PA单元的宽带PA架构
高效率和宽带功率放大器(pa)是实现下一代毫米波系统和多功能通信、传感和成像阵列的关键。由于硅器件在毫米波频率下的低f/f_{max}$、低击穿电压和低增益,InP hbt已成为实现50 GHz以上紧凑型相控阵和MIMO阵列的高效率、高功率和宽带发射机前端的有希望的候选器件。在本文中,我们通过特别设计的不对称功率组合架构和堆叠的PA单元,提出了250 nm InP HBT工艺中覆盖50-70 GHz和64-110 GHz的两种宽带PA架构。两个波段的峰值功率均大于20 dBm,峰值输出集电极效率(η - out)均超过40%,总集电极效率(η)均超过30%,峰值功率附加效率(PAE)均> 23%。这项工作提出了峰值功率大于20 dBm的最高带宽和最高效率的pa之一。
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