Development of Laser-Produced Tin Plasma-Based EUV Light Source Technology for HVM EUV Lithography

J. Fujimoto, T. Hori, T. Yanagida, H. Mizoguchi
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引用次数: 17

Abstract

Since 2002, we have been developing a carbon dioxide (CO2) laser-produced tin (Sn) plasma (LPP) extreme ultraviolet (EUV) light source, which is the most promising solution because of the 13.5 nm wavelength high power (>200 W) light source for high volume manufacturing. EUV lithography is used for its high efficiency, power scalability, and spatial freedom around plasma. We believe that the LPP scheme is the most feasible candidate for the EUV light source for industrial use. We have several engineering data from our test tools, which include 93% Sn ionization rate, 98% Sn debris mitigation by a magnetic field, and 68% CO2 laser energy absorption rate. The way of dispersion of Sn by prepulse laser is key to improve conversion efficiency (CE). We focus on prepulsed laser pulsed duration. When we have optimized pulse duration from nanosecond to picosecond, we have obtained maximum 4.7% CE (CO2 laser to EUV; our previous data was 3.8%) at 2 mJ EUV pulse energy. Based on these data we are developing our first light source as our product: “GL200E.” The latest data and the overview of EUV light source for the industrial EUV lithography are reviewed in this paper.
激光锡等离子体EUV光刻光源技术的发展
自2002年以来,我们一直在开发二氧化碳(CO2)激光生产锡(Sn)等离子体(LPP)极紫外(EUV)光源,这是最有前途的解决方案,因为13.5 nm波长的高功率(> 200w)光源适合大批量生产。EUV光刻技术以其高效率、功率可扩展性和等离子体周围的空间自由而闻名。我们认为LPP方案是工业用EUV光源中最可行的候选方案。我们从测试工具中获得了一些工程数据,包括93%的锡电离率、98%的磁场锡碎片缓减率和68%的CO2激光能量吸收率。预脉冲激光对锡的色散方式是提高转换效率的关键。我们主要研究预脉冲激光的脉冲持续时间。当我们将脉冲持续时间从纳秒优化到皮秒时,我们获得了最大4.7%的CE (CO2)激光到EUV;我们之前的数据是3.8%)在2 mJ EUV脉冲能量下。基于这些数据,我们正在开发我们的第一个光源作为我们的产品:“GL200E”。本文综述了工业用极紫外光刻光源的最新研究进展。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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