A design of a multi-sensor platform by System-Level integration in the package

Abstract

The design, assembly and testing of a multi-sensor platform that could be used to detect specific parameters of ambient environment is presented in this paper. This platform will be packaged using System-Level integration and could be used as one of the nodes in a sensor network. It is composed of commercial off-the-shelf components, which allows low cost and flexible component selection. The sensors including an air pressure sensor, an ambient light sensor, and a motion tracking device. A FLASH memory which could be used for storing the measured data is also included. A MCU block is the core device for controlling and communicating with other blocks. A four-layered PCB is carefully designed and simulated to ensure a smaller shape and a reliable electrical environment. All components are assembled on this PCB to constitute a SiP with 16 IOs in Quad Flat No-lead format, thereafter, a prototype is implemented and a testing procedure is taken to verify the functionality of this platform.