Thermal Management of the High-power Electronics in High Temperature Downhole Environment

Jiale Peng, Wei Lan, Yujun Wang, Yiming Ma, Xiaobing Luo
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引用次数: 7

Abstract

The logging tool, which is utilized to detect the underground oil and gas resources, is a typical electronic instrument working in extremely high-temperature downhole environment (∼200°C) for more than 9 hours. Generally, the internal electronics can only withstand the temperature below 125°C, and thus adopting thermal management methods to ensure its normal operation turns into an urgent task. Previous researches mainly focused on the thermal management methods of the low-power electronics in the logging tool, but these methods were not suitable for high-power electronics due to a significant thermal resistance between the heat source and heat storage module. To solve this issue, a new thermal management method of integrating the heat sink and the heat storage module was proposed to enhance the heat transfer between electronics and heat storage module. The thermal performance of the structure was evaluated by the finite element method and the experiment. The simulated results show that the temperature of heat transfer and storage integrated structure is lower and more uniform than that of conventional finned heat dissipation structure, the maximum temperature of heat source drops from 165.8°C to 133.4°C, and the utilization rate of latent heat increases from 52.8% to 63.5%. Besides, inserting heat pipes to PCMs significantly reduces the maximum temperature to 110.7°C and increases the latent heat utilization rate to 99.0%. Further, the experimental results show that the electronics temperature can maintain below 125°C for 9 hours with the proposed thermal management method, which is consistent with the simulated results.
高温井下环境下大功率电子器件的热管理
该测井工具用于探测地下油气资源,是一种典型的电子仪器,可在井下极端高温环境(~ 200°C)下工作9小时以上。一般来说,内部电子设备只能承受125℃以下的温度,因此采用热管理方法来保证其正常工作成为一项紧迫的任务。以往的研究主要集中在测井工具中低功耗电子器件的热管理方法上,但由于热源与储热模块之间存在较大的热阻,这些方法不适用于大功率电子器件。为了解决这一问题,提出了一种集成散热器和蓄热模块的新型热管理方法,以增强电子器件和蓄热模块之间的热传递。通过有限元法和实验对结构的热性能进行了评价。模拟结果表明,与传统翅片散热结构相比,换热蓄热一体化结构温度更低、更均匀,热源最高温度从165.8℃降至133.4℃,潜热利用率从52.8%提高到63.5%。此外,在pcm中插入热管显著降低了最高温度至110.7℃,潜热利用率提高到99.0%。实验结果表明,采用该热管理方法,电子元件温度可保持在125℃以下9小时,与仿真结果一致。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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