Memory Packaging Challenges for a Growing Market

Abstract

Increasing demands for storage and high-performance memory in applications such as artificial intelligence (AI), machine learning and processing storage are driving long-term growth in the market. This paper will highlight the key challenges encountered in packaging next-generation memory devices and discuss some of the technological developments required to address them while considering performance, cost, and yield. An evaluation is highlighted of a remote microwave plasma process to remove damage caused by laser ablation during the wafer dicing process that shows an improvement in die strength using this process.