3D Kinetic Monte Carlo Simulation of Electromigration in Multi-layer Interconnects

Abstract

A 3D kinetic Monte Carlo simulator is developed to describe the electromigration (EM) behaviors in multi-layer interconnects based on the proposed physical mechanism including the metal ions activation, hopping and aggregation processes. The effects of e-wind, hydrostatic stress and Joule heat on EM are implemented in the simulator. The void locations in two directions of upstream and downstream current flow are well reproduced by the simulator, consistent with the experimental observations. The microscopic void morphology and EM degradation are investigated with different operation schemes.