P. Coudrain, J. Colonna, L. Collin, R. Prieto, L. Fréchette, J. Barrau, G. Savelli, P. Vivet, Q. Struss, J. Widiez, K. Vladimirova, K. Triantopoulos, H. Beckrich-Ros, M. Vilarrubí, G. Laguna, H. Azarkish, M. Shirazi, J. Michailos
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引用次数: 1
Abstract
This paper describes evolutions of circuit environment to face an ever-increasing thermal challenge, from early design stage down to the final package. To illustrate this critical concern we give a portrayal of innovative technologies and concepts studied for efficient thermal management from low to high power electronics, with an emphasis on hot spot management.
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