Power-Combined Rectenna Array for X-Band Wireless Power Transfer

Eric Kwiatkowski, C. Rodenbeck, T. Barton, Z. Popovic
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引用次数: 4

Abstract

This work presents an RF power-combined rectenna array operating at 10 GHz and designed for low incident power densities ranging from 0.1-100 µW/cm2. The array consists of unit-cell sequentially-fed four-element patch antenna subarrays designed to receive incident waves with circular polarization. The incident power is converted to dc using a single-ended Schottky diode rectifier. The rectifier is first characterized over input power and dc load individually and with a single sub-array. A 4-to-1 RF power-combining network is designed to further improve RF-to-dc conversion efficiency and output power at the lower-bound power density of 0.1 µW/cm2. A three-layer PCB with off-the-shelf components enables straightforward scaling to larger apertures.
用于x波段无线电力传输的功率组合整流天线阵列
这项工作提出了一种工作频率为10 GHz的射频功率组合整流天线阵列,设计用于低入射功率密度范围为0.1-100 μ W/cm2。该阵列由单元连续馈电四元贴片天线子阵列组成,设计用于接收圆极化入射波。使用单端肖特基二极管整流器将入射功率转换为直流电。首先对整流器的输入功率和直流负载分别进行表征,并具有单个子阵列。设计了一种4比1的射频功率组合网络,以进一步提高RF到dc的转换效率和输出功率,功率密度下限为0.1 μ W/cm2。具有现成组件的三层PCB可以直接缩放到更大的孔径。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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