Examination of design and manufacturing issues in a 10 nm double gate MOSFET using nonequilibrium Green's function simulation

Z. Ren, R. Venugopal, S. Datta, M. Lundstrom
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引用次数: 43

Abstract

The double gate (DG) MOSFET and similar structures provide the electrostatic integrity needed to scale devices to their limits. In this paper, we use a non-equilibrium Green's function (NEGF) approach to examine 10 nm-scale device design and manufacturing issues realistically. NEGF simulations are used to examine: (i) choice of body thickness, (ii) effect of body thickness variations, (iii) the required junction abruptness, (iv) sensitivity of the device to gate-S/D (source/drain) over/underlap, and (v) the impact of metal-semiconductor contact resistance. The results of this study identify key device challenges for 10 nm-scale MOSFETs.
利用非平衡格林函数模拟研究10nm双栅MOSFET的设计和制造问题
双栅(DG) MOSFET和类似的结构提供了将器件扩展到其极限所需的静电完整性。在本文中,我们使用非平衡格林函数(NEGF)方法来实际检查10纳米级器件的设计和制造问题。NEGF模拟用于检查:(i)机身厚度的选择,(ii)机身厚度变化的影响,(iii)所需的结的突然度,(iv)器件对栅极s /D(源/漏)过/欠接的灵敏度,以及(v)金属半导体接触电阻的影响。本研究的结果确定了10纳米级mosfet的关键器件挑战。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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