Jianbo Liang, S. Shimizu, S. Nishida, N. Shigekawa, M. Arai
{"title":"4H-SiC/Si Heterojunction Bipolar Transistors Fabricated by Surface Activated Bonding","authors":"Jianbo Liang, S. Shimizu, S. Nishida, N. Shigekawa, M. Arai","doi":"10.1149/2.0041511SSL","DOIUrl":null,"url":null,"abstract":"4H-SiC/Si heterojunction bipolar transistors with emitter-up (E-up) and collector-up (C-up) configurations were fabricated by surface activated bonding for the first time. Their electrical characteristics were measured at raised ambient temperatures. The common-base current gain α increased as the temperature was raised in the both E-up and C-up structures. In the E-up structure, α reached to ≈ 0.99 at 573 K. Improvements in both device structures and surface activated bonding conditions should provide further improvements in device performance. © 2015 The Electrochemical Society. [DOI: 10.1149/2.0041511ssl] All rights reserved.","PeriodicalId":11423,"journal":{"name":"ECS Solid State Letters","volume":"15 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2015-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"10","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ECS Solid State Letters","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1149/2.0041511SSL","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 10
表面活化键合制备4H-SiC/Si异质结双极晶体管
采用表面激活键合技术首次制备了发射向上(up)和集电极向上(C-up)结构的4H-SiC/Si异质结双极晶体管。在升高的环境温度下测量了它们的电特性。在up和C-up结构中,共基电流增益α随温度升高而增大。在up结构中,α在573 K时达到≈0.99。器件结构和表面活化键合条件的改进将进一步提高器件性能。©2015电化学学会。[DOI: 10.1149/2.0041511ssl]版权所有。
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