Improved Finite Element Modeling of Moisture Diffusion Considering Discontinuity at Material Interfaces in Electronic Packages

Abstract

The modeling of moisture diffusion plays an important role for the integrity and reliability of electronic packages. In this paper, a new normalization approach and its implementation using ANSYS finite element analysis software are presented. Such an approach can solve the diffusion problem with varying temperature and humidity. Two different options in moisture diffusion modeling provided by ANSYS are discussed. As a validation, the numerical results are compared to that using the conventional normalization approach.