Study on bumps deformation of flip chip bonding process

Abstract

The flip chip package is an advanced chip interconnection technology, which has become a main technology of high density package. This paper mainly studies the influence of bumps deformation in the flip chip bonding process on connection reliability, which provides theoretical reference for the flip bonding process. Bumps deformation is a key factor for the chip reliable connection in the flip chip bonding. Bonding force directly determines the bumps deformation. The quality of the bumps will affect the reliability of reflow soldering and under-fill processes. This paper builds a three-dimensional model of flip chip bonding. By the FEM simulation analysis, the relationship between bonding force and bumps deformation is studied. The process parameters are optimized by comparing the experimental data with simulation result. Finally, the reliability evaluation method of flip chip bonding is obtained, which can be used to guide the research and development of the bonding equipment.