Reliability Performance of Lead–Free SAC Solder Joints on Electroless Ni/Immersion Au and Electroless Ni/Electroless Pd/Immersion Au Subject to Long–Term Isothermal Aging
Z. Hai, Jiawei Zhang, Chaobo Shen, E. K. Snipes, M. Bozack, John L. Evans, J. Suhling
{"title":"Reliability Performance of Lead–Free SAC Solder Joints on Electroless Ni/Immersion Au and Electroless Ni/Electroless Pd/Immersion Au Subject to Long–Term Isothermal Aging","authors":"Z. Hai, Jiawei Zhang, Chaobo Shen, E. K. Snipes, M. Bozack, John L. Evans, J. Suhling","doi":"10.1166/JOM.2014.1047","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":38114,"journal":{"name":"International Journal of Mechatronics and Automation","volume":"17 1","pages":"100-108"},"PeriodicalIF":0.0000,"publicationDate":"2014-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of Mechatronics and Automation","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1166/JOM.2014.1047","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"Engineering","Score":null,"Total":0}