Comparison of Plasma Ion Deposition Processes at Industrial Scale

Satoshi Hirota, R. Cremer, Tetsuya Takahashi
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Abstract

A relatively new industrial sputtering technology based on High Power Impulse Magnetron Sputtering (HiPIMS) is demonstrated. HiPIMS is a magnetron discharge process like conventional dc magnetron sputtering (DCMS). However, momentarily input power is approximately ten times higher in magnitude. In this study HiPIMS discharge is characterized by Optical Emission Spectroscopy (OES), and compared with DCMS and cathodic arc (CA). The result shows that the HiPIMS provides the high ionization degree of the sputtered metal species. The degree of Ti ionization is found to be increased as the pulse frequency of HiPIMS is decreased, which enables to adjust the sputter plasma properties ranging from lowmetal ionization to highmetal ionization by controlling the pulse frequency. This expands an opportunity to tailor the properties of sputtered thin ˆlms.
工业规模等离子体离子沉积工艺的比较
介绍了一种基于大功率脉冲磁控溅射的新型工业溅射技术。HiPIMS是一种与传统直流磁控溅射(DCMS)类似的磁控放电过程。然而,瞬时输入功率大约是其量级的十倍。本研究利用光学发射光谱(OES)对HiPIMS放电进行了表征,并与DCMS和阴极电弧(CA)进行了比较。结果表明,HiPIMS提供了高电离度的溅射金属。随着HiPIMS脉冲频率的降低,Ti的电离程度增加,从而可以通过控制脉冲频率来调节溅射等离子体的特性,从低金属电离到高金属电离。这为定制溅射薄膜的特性提供了机会。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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