Integrating through-silicon vias with solder free, compliant interconnects for novel, large area interposers

I. Shubin, E. Chow, A. Chow, H. Thacker, D. Debruyker, K. Fujimoto, K. Raj, A. Krishnamoorthy, J. Mitchell, J. Cunningham
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引用次数: 3

Abstract

A novel packaging module is described that is based on co-integration of flexible micro-spring interconnects with through silicon copper vias (TSVs) into a passive large area silicon interposer. We report on the packaging test vehicles based on such interposers that are designed to demonstrate a wafer scale integration process to form TSV+spring interconnects with high yield and low resistance. Our goal is to develop a scalable, large area die or MCM packaging platform to enable stress-free, readily reworkable packaging of chips and components with different functionality and technology. We show interposer layouts, share process details and characterization methods.
集成硅通孔与无焊,兼容的互连为新颖的,大面积的中间层
介绍了一种新型封装模块,该封装模块将带有硅铜通孔(tsv)的柔性微弹簧互连协整成无源大面积硅中间层。我们报告了基于这种中间体的封装测试车辆,旨在展示晶圆级集成过程,以形成高成品率和低电阻的TSV+弹簧互连。我们的目标是开发一个可扩展的,大面积的芯片或MCM封装平台,使具有不同功能和技术的芯片和组件的无压力,易于重新组装。我们展示了中间层布局,分享了过程细节和表征方法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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