{"title":"Towards IP integration on SoC: a case study of high-throughput and low-cost wrapper design on a novel IBUS architecture","authors":"Xiaokun Yang, Shi Sha, Ishaq Unwala, Jiang Lu","doi":"10.1049/iet-cdt.2019.0090","DOIUrl":null,"url":null,"abstract":"<div>\n <p>To integrate third-party intellectual properties (IPs) into a new system-on-chip (SoC) architecture is a big challenge. Therefore, this study first presents a new bus protocol named as integrated bus (IBUS), and more important, a configurable bus wrapper for connecting AXI3-interfaced IPs into IBUS is further proposed, aiming to finding the optimal balance between bus efficiency and resource cost in terms of field-programming gate array slice count, bus transfer latency, and energy consumption. As a case study, the authors implemented three IBUS wrappers for integrating three AXI3-interfaced verification IPs into an IBUS SoC. Experimental results show that their proposed work achieves a higher valid data throughput ( in the block test and in the cipher test) compared with the designs on conventional bridge-based SoC integration, as well as a large reduction in the normalised slice-time-power (18.73% in the block benchmark and 23.45% in the cipher benchmark) when setting the same weights of slice number, data transfer latency, and energy dissipation.</p>\n </div>","PeriodicalId":50383,"journal":{"name":"IET Computers and Digital Techniques","volume":"14 6","pages":"353-362"},"PeriodicalIF":1.1000,"publicationDate":"2020-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ietresearch.onlinelibrary.wiley.com/doi/epdf/10.1049/iet-cdt.2019.0090","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IET Computers and Digital Techniques","FirstCategoryId":"94","ListUrlMain":"https://onlinelibrary.wiley.com/doi/10.1049/iet-cdt.2019.0090","RegionNum":4,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE","Score":null,"Total":0}
引用次数: 1
Abstract
To integrate third-party intellectual properties (IPs) into a new system-on-chip (SoC) architecture is a big challenge. Therefore, this study first presents a new bus protocol named as integrated bus (IBUS), and more important, a configurable bus wrapper for connecting AXI3-interfaced IPs into IBUS is further proposed, aiming to finding the optimal balance between bus efficiency and resource cost in terms of field-programming gate array slice count, bus transfer latency, and energy consumption. As a case study, the authors implemented three IBUS wrappers for integrating three AXI3-interfaced verification IPs into an IBUS SoC. Experimental results show that their proposed work achieves a higher valid data throughput ( in the block test and in the cipher test) compared with the designs on conventional bridge-based SoC integration, as well as a large reduction in the normalised slice-time-power (18.73% in the block benchmark and 23.45% in the cipher benchmark) when setting the same weights of slice number, data transfer latency, and energy dissipation.
期刊介绍:
IET Computers & Digital Techniques publishes technical papers describing recent research and development work in all aspects of digital system-on-chip design and test of electronic and embedded systems, including the development of design automation tools (methodologies, algorithms and architectures). Papers based on the problems associated with the scaling down of CMOS technology are particularly welcome. It is aimed at researchers, engineers and educators in the fields of computer and digital systems design and test.
The key subject areas of interest are:
Design Methods and Tools: CAD/EDA tools, hardware description languages, high-level and architectural synthesis, hardware/software co-design, platform-based design, 3D stacking and circuit design, system on-chip architectures and IP cores, embedded systems, logic synthesis, low-power design and power optimisation.
Simulation, Test and Validation: electrical and timing simulation, simulation based verification, hardware/software co-simulation and validation, mixed-domain technology modelling and simulation, post-silicon validation, power analysis and estimation, interconnect modelling and signal integrity analysis, hardware trust and security, design-for-testability, embedded core testing, system-on-chip testing, on-line testing, automatic test generation and delay testing, low-power testing, reliability, fault modelling and fault tolerance.
Processor and System Architectures: many-core systems, general-purpose and application specific processors, computational arithmetic for DSP applications, arithmetic and logic units, cache memories, memory management, co-processors and accelerators, systems and networks on chip, embedded cores, platforms, multiprocessors, distributed systems, communication protocols and low-power issues.
Configurable Computing: embedded cores, FPGAs, rapid prototyping, adaptive computing, evolvable and statically and dynamically reconfigurable and reprogrammable systems, reconfigurable hardware.
Design for variability, power and aging: design methods for variability, power and aging aware design, memories, FPGAs, IP components, 3D stacking, energy harvesting.
Case Studies: emerging applications, applications in industrial designs, and design frameworks.