{"title":"Rectilinear routing algorithm for crosstalk minimisation in 2D and 3D IC","authors":"Khokan Mondal, Subhajit Das, Tuhina Samanta","doi":"10.1049/iet-cdt.2020.0010","DOIUrl":null,"url":null,"abstract":"<div>\n <p>The coupling capacitance and inductance of 2D and 3D integrated circuit (IC) interconnects in deep sub-micron technology has been increased due to reduced coupling distance in such a way that their magnitudes become comparable to the area and fringing capacitance of an interconnect. This leads to an increasing risk of failure due to unintentional noise and a need for accurate noise assessment. Incorrect noise estimation could either result in defects in circuit design if the design resources are understated or it will end up with a waste of overestimation resources. In this study, a crosstalk noise model for coupled RLC on-chip interconnects has been demonstrated. Subsequently, a novel time-efficient method is proposed to estimate and optimise the crosstalk noise precisely. The proposed method calculates coupling noise as well as optimises crosstalk noise, which has been validated using SPICE. Besides the estimation of crosstalk noise for 2D interconnect, this study also estimates the crosstalk noise for through-silicon-via (TSV), which is used to connect different dies vertically in a 3D IC. Under high-frequency operation, effects of signal rise time, TSV structure (height of the TSV), substrate resistivity and the guarding TSV termination on crosstalk noise have also been studied in this work.</p>\n </div>","PeriodicalId":50383,"journal":{"name":"IET Computers and Digital Techniques","volume":"14 6","pages":"263-271"},"PeriodicalIF":1.1000,"publicationDate":"2020-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1049/iet-cdt.2020.0010","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IET Computers and Digital Techniques","FirstCategoryId":"94","ListUrlMain":"https://onlinelibrary.wiley.com/doi/10.1049/iet-cdt.2020.0010","RegionNum":4,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE","Score":null,"Total":0}
引用次数: 0
Abstract
The coupling capacitance and inductance of 2D and 3D integrated circuit (IC) interconnects in deep sub-micron technology has been increased due to reduced coupling distance in such a way that their magnitudes become comparable to the area and fringing capacitance of an interconnect. This leads to an increasing risk of failure due to unintentional noise and a need for accurate noise assessment. Incorrect noise estimation could either result in defects in circuit design if the design resources are understated or it will end up with a waste of overestimation resources. In this study, a crosstalk noise model for coupled RLC on-chip interconnects has been demonstrated. Subsequently, a novel time-efficient method is proposed to estimate and optimise the crosstalk noise precisely. The proposed method calculates coupling noise as well as optimises crosstalk noise, which has been validated using SPICE. Besides the estimation of crosstalk noise for 2D interconnect, this study also estimates the crosstalk noise for through-silicon-via (TSV), which is used to connect different dies vertically in a 3D IC. Under high-frequency operation, effects of signal rise time, TSV structure (height of the TSV), substrate resistivity and the guarding TSV termination on crosstalk noise have also been studied in this work.
期刊介绍：
IET Computers & Digital Techniques publishes technical papers describing recent research and development work in all aspects of digital system-on-chip design and test of electronic and embedded systems, including the development of design automation tools (methodologies, algorithms and architectures). Papers based on the problems associated with the scaling down of CMOS technology are particularly welcome. It is aimed at researchers, engineers and educators in the fields of computer and digital systems design and test.
The key subject areas of interest are:
Design Methods and Tools: CAD/EDA tools, hardware description languages, high-level and architectural synthesis, hardware/software co-design, platform-based design, 3D stacking and circuit design, system on-chip architectures and IP cores, embedded systems, logic synthesis, low-power design and power optimisation.
Simulation, Test and Validation: electrical and timing simulation, simulation based verification, hardware/software co-simulation and validation, mixed-domain technology modelling and simulation, post-silicon validation, power analysis and estimation, interconnect modelling and signal integrity analysis, hardware trust and security, design-for-testability, embedded core testing, system-on-chip testing, on-line testing, automatic test generation and delay testing, low-power testing, reliability, fault modelling and fault tolerance.
Processor and System Architectures: many-core systems, general-purpose and application specific processors, computational arithmetic for DSP applications, arithmetic and logic units, cache memories, memory management, co-processors and accelerators, systems and networks on chip, embedded cores, platforms, multiprocessors, distributed systems, communication protocols and low-power issues.
Configurable Computing: embedded cores, FPGAs, rapid prototyping, adaptive computing, evolvable and statically and dynamically reconfigurable and reprogrammable systems, reconfigurable hardware.
Design for variability, power and aging: design methods for variability, power and aging aware design, memories, FPGAs, IP components, 3D stacking, energy harvesting.
Case Studies: emerging applications, applications in industrial designs, and design frameworks.
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
