Performance analysis of dynamic CMOS circuit based on node-discharger and twist-connected transistors

IF 1.1 4区 计算机科学 Q4 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
Dhandapani Vaithiyanathan, Ravindra Kumar, Ashima Rai, Khushboo Sharma
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引用次数: 3

Abstract

The incessant growth of devices such as mobile phones, digital cameras, and other portable electronic gadgets has led to a higher amount of research being dedicated to the low power digital and analogue circuits. In this study, a low power-delay-product (PDP) dynamic complementary metal oxide semiconductor (CMOS) circuit design using small swing domino logic with twist-connected transistors is proposed. An improvement in PDP can be achieved by using a node-discharger circuit in the conventional design. The conventional benchmark and modified circuits are implemented in 90 nm CMOS technology with different power supplies, i.e. 1.2, 1, and 0.9 V. Furthermore, a decrease in voltage level for logic ‘1’ and an increase in voltage level for logic ‘0’ is achieved while maintaining the logic threshold accordingly at half of the supply voltage. So, the output voltage swing is reduced and the unnecessary nodes of the pull down network get discharged in pre-charge phase, eventually leading to an improvement when compared with conventional design in overall PDP by 43.21 and 46.83% for two inverted two-input and three-input AND gate dynamic benchmarks, respectively, for a power supply of 1 V.

Abstract Image

基于节点放电器和扭接晶体管的动态CMOS电路性能分析
手机、数码相机和其他便携式电子设备等设备的不断增长,导致对低功耗数字和模拟电路的研究越来越多。在本研究中,提出了一种低功率延迟产品(PDP)动态互补金属氧化物半导体(CMOS)电路设计,该电路使用具有扭接晶体管的小摆动多米诺逻辑。可以通过在传统设计中使用节点放电器电路来实现PDP的改进。传统的基准电路和改进电路是在具有不同电源(即1.2、1和0.9V)的90nm CMOS技术中实现的。此外,在将逻辑阈值相应地保持在电源电压的一半的同时,实现了逻辑“1”的电压电平的降低和逻辑“0”的电压水平的增加。因此,输出电压摆动减少,下拉网络的不必要节点在预充电阶段放电,最终与传统设计相比,对于1V的电源,两个反相的两输入和三输入与门动态基准,整体PDP分别提高了43.21%和46.83%。
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来源期刊
IET Computers and Digital Techniques
IET Computers and Digital Techniques 工程技术-计算机:理论方法
CiteScore
3.50
自引率
0.00%
发文量
12
审稿时长
>12 weeks
期刊介绍: IET Computers & Digital Techniques publishes technical papers describing recent research and development work in all aspects of digital system-on-chip design and test of electronic and embedded systems, including the development of design automation tools (methodologies, algorithms and architectures). Papers based on the problems associated with the scaling down of CMOS technology are particularly welcome. It is aimed at researchers, engineers and educators in the fields of computer and digital systems design and test. The key subject areas of interest are: Design Methods and Tools: CAD/EDA tools, hardware description languages, high-level and architectural synthesis, hardware/software co-design, platform-based design, 3D stacking and circuit design, system on-chip architectures and IP cores, embedded systems, logic synthesis, low-power design and power optimisation. Simulation, Test and Validation: electrical and timing simulation, simulation based verification, hardware/software co-simulation and validation, mixed-domain technology modelling and simulation, post-silicon validation, power analysis and estimation, interconnect modelling and signal integrity analysis, hardware trust and security, design-for-testability, embedded core testing, system-on-chip testing, on-line testing, automatic test generation and delay testing, low-power testing, reliability, fault modelling and fault tolerance. Processor and System Architectures: many-core systems, general-purpose and application specific processors, computational arithmetic for DSP applications, arithmetic and logic units, cache memories, memory management, co-processors and accelerators, systems and networks on chip, embedded cores, platforms, multiprocessors, distributed systems, communication protocols and low-power issues. Configurable Computing: embedded cores, FPGAs, rapid prototyping, adaptive computing, evolvable and statically and dynamically reconfigurable and reprogrammable systems, reconfigurable hardware. Design for variability, power and aging: design methods for variability, power and aging aware design, memories, FPGAs, IP components, 3D stacking, energy harvesting. Case Studies: emerging applications, applications in industrial designs, and design frameworks.
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