Efficient and flexible hardware structures of the 128 bit CLEFIA block cipher

IF 1.1 4区 计算机科学 Q4 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
Bahram Rashidi
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引用次数: 7

Abstract

In this study, high-throughput and flexible hardware implementations of the CLEFIA lightweight block cipher are presented. A unified processing element is designed and shared for implementing of generalised Feistel network that computes round keys and encryption process in the two separate times. The most complex blocks in the CLEFIA algorithm are substitution boxes ( and ). The S-box is implemented based on area-optimised combinational logic circuits. In the proposed S-box structure, the number of logic gates and critical path delay are reduced by using the simplification of computation terms. The S-box consists of three steps: a field inversion over and two affine transformations over . The inversion operation is implemented over the composite field instead of inversion over which is an important factor for the reduction of area consumption. In addition, we proposed a flexible structure that can perform various configurations of CLEFIA to support variable key sizes: 128, 192 and 256 bit. Implementation results of the proposed architectures in 180 nm complementary metal–oxide–semiconductor technology for different key sizes are achieved. The results show improvements in terms of execution time, throughput and throughput/area compared with other related works.

Abstract Image

高效灵活的128位CLEFIA分组密码硬件结构
在这项研究中,提出了CLEFIA轻量级分组密码的高吞吐量和灵活的硬件实现。设计并共享了一个统一的处理单元,用于实现广义Feistel网络,该网络在两个不同的时间内计算循环密钥和加密过程。CLEFIA算法中最复杂的块是替换框(和)。S盒是基于面积优化的组合逻辑电路实现的。在所提出的S盒结构中,通过简化计算项,减少了逻辑门的数量和关键路径延迟。S盒由三个步骤组成:一个域反转和两个仿射变换。反演操作是在复合场上实现的,而不是反演,这是减少面积消耗的重要因素。此外,我们提出了一种灵活的结构,可以执行CLEFIA的各种配置,以支持可变的密钥大小:128、192和256位。针对不同的密钥大小,在180 nm互补金属-氧化物-半导体技术中实现了所提出的架构的结果。结果表明,与其他相关工作相比,在执行时间、吞吐量和吞吐量/面积方面有所改进。
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来源期刊
IET Computers and Digital Techniques
IET Computers and Digital Techniques 工程技术-计算机:理论方法
CiteScore
3.50
自引率
0.00%
发文量
12
审稿时长
>12 weeks
期刊介绍: IET Computers & Digital Techniques publishes technical papers describing recent research and development work in all aspects of digital system-on-chip design and test of electronic and embedded systems, including the development of design automation tools (methodologies, algorithms and architectures). Papers based on the problems associated with the scaling down of CMOS technology are particularly welcome. It is aimed at researchers, engineers and educators in the fields of computer and digital systems design and test. The key subject areas of interest are: Design Methods and Tools: CAD/EDA tools, hardware description languages, high-level and architectural synthesis, hardware/software co-design, platform-based design, 3D stacking and circuit design, system on-chip architectures and IP cores, embedded systems, logic synthesis, low-power design and power optimisation. Simulation, Test and Validation: electrical and timing simulation, simulation based verification, hardware/software co-simulation and validation, mixed-domain technology modelling and simulation, post-silicon validation, power analysis and estimation, interconnect modelling and signal integrity analysis, hardware trust and security, design-for-testability, embedded core testing, system-on-chip testing, on-line testing, automatic test generation and delay testing, low-power testing, reliability, fault modelling and fault tolerance. Processor and System Architectures: many-core systems, general-purpose and application specific processors, computational arithmetic for DSP applications, arithmetic and logic units, cache memories, memory management, co-processors and accelerators, systems and networks on chip, embedded cores, platforms, multiprocessors, distributed systems, communication protocols and low-power issues. Configurable Computing: embedded cores, FPGAs, rapid prototyping, adaptive computing, evolvable and statically and dynamically reconfigurable and reprogrammable systems, reconfigurable hardware. Design for variability, power and aging: design methods for variability, power and aging aware design, memories, FPGAs, IP components, 3D stacking, energy harvesting. Case Studies: emerging applications, applications in industrial designs, and design frameworks.
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