Yasir A. Shah, Khalid Javeed, Muhammad I. Shehzad, Shoaib Azmat
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引用次数: 4
Abstract
Recent studies have shown that existing elliptic curve-based cryptographic standards provide backdoors for manipulation and hence compromise the security. In this regard, two new elliptic curves known as Curve448 and Curve25519 are recently recommended by IETF for transport layer security future generations. Hence, cryptosystems built over these elliptic curves are expected to play a vital role in the near future for secure communications. A high-speed elliptic curve cryptographic processor (ECCP) for the Curve448 is proposed in this study. The area of the ECCP is optimised by performing different modular operations required for the elliptic curve Diffie–Hellman protocol through a unified architecture. The critical path delay of the proposed ECCP is optimised by adopting the redundant-signed-digit technique for arithmetic operations. The segmentation approach is introduced to reduce the required number of clock cycles for the ECCP. The proposed ECCP is developed using look-up-tables (LUTs) only, and hence it can be ported to any field-programmable gate array family or standard ASIC libraries. The authors' ECCP design offers higher speed without any significant area overhead to recent designs reported in the literature.
期刊介绍:
IET Computers & Digital Techniques publishes technical papers describing recent research and development work in all aspects of digital system-on-chip design and test of electronic and embedded systems, including the development of design automation tools (methodologies, algorithms and architectures). Papers based on the problems associated with the scaling down of CMOS technology are particularly welcome. It is aimed at researchers, engineers and educators in the fields of computer and digital systems design and test.
The key subject areas of interest are:
Design Methods and Tools: CAD/EDA tools, hardware description languages, high-level and architectural synthesis, hardware/software co-design, platform-based design, 3D stacking and circuit design, system on-chip architectures and IP cores, embedded systems, logic synthesis, low-power design and power optimisation.
Simulation, Test and Validation: electrical and timing simulation, simulation based verification, hardware/software co-simulation and validation, mixed-domain technology modelling and simulation, post-silicon validation, power analysis and estimation, interconnect modelling and signal integrity analysis, hardware trust and security, design-for-testability, embedded core testing, system-on-chip testing, on-line testing, automatic test generation and delay testing, low-power testing, reliability, fault modelling and fault tolerance.
Processor and System Architectures: many-core systems, general-purpose and application specific processors, computational arithmetic for DSP applications, arithmetic and logic units, cache memories, memory management, co-processors and accelerators, systems and networks on chip, embedded cores, platforms, multiprocessors, distributed systems, communication protocols and low-power issues.
Configurable Computing: embedded cores, FPGAs, rapid prototyping, adaptive computing, evolvable and statically and dynamically reconfigurable and reprogrammable systems, reconfigurable hardware.
Design for variability, power and aging: design methods for variability, power and aging aware design, memories, FPGAs, IP components, 3D stacking, energy harvesting.
Case Studies: emerging applications, applications in industrial designs, and design frameworks.