Weixian Zhang, Qihua Wu, Wen Shao, Fangyu Li, Hongzhu Chen, Yong Pei and Jiajia Wang
{"title":"Soluble and cross-linkable polyimides from a vanillin-derived diamine: preparation, post-polymerization and properties†","authors":"Weixian Zhang, Qihua Wu, Wen Shao, Fangyu Li, Hongzhu Chen, Yong Pei and Jiajia Wang","doi":"10.1039/D3PY00755C","DOIUrl":null,"url":null,"abstract":"<p >A novel trifluorovinyl-ether (–OCF<img>CF<small><sub>2</sub></small>, TFVE) functionalized diamine (<strong>DA-TFVE</strong>) with a triarylmethane structure was successfully obtained from renewable vanillin through a Brønsted acidic ionic liquid catalyzed Friedel–Crafts reaction. Subsequently, traditional two-step condensations between <strong>DA-TFVE</strong> and dianhydride (6FDA and CBDA) were used to prepare two linear polyimides (<strong>PI-1</strong> and <strong>PI-2</strong>, respectively) containing TFVE side groups. Both polyimides exhibited excellent film-forming ability and good solubility in common organic solvents. Upon heating, the linear polyimides could be transformed into cross-linked polyimides (<strong><em>c</em>PI-1</strong> and <strong><em>c</em>PI-2</strong>) with perfluorocyclobutyl (PFCB) ether linkers through thermal [2π + 2π] post-polymerization of TFVE groups. Surprisingly, both <strong><em>c</em>PI-1</strong> and <strong><em>c</em>PI-2</strong> exhibited high mechanical strength with a storage modulus of more than 2.0 GPa at room temperature, as well as outstanding thermal stability with glass transition temperatures of 402 °C and 374 °C, respectively. The polymer films before and after thermal crosslinking showed high transparency. In particular, a transmittance of 73% at 450 nm and 81% at 500 nm was observed for the colorless polyimide <strong>PI-2</strong> with aliphatic segments. X-ray diffraction results of the obtained PIs showed that the average inter-chain distances (<em>d</em>-spacing) were 0.44–0.59 nm, indicating the hindered chain packing caused by PFCB linkers between the polymer chains. All these results suggested their potential application as candidate materials in high-performance packaging and flexible electronics.</p>","PeriodicalId":100,"journal":{"name":"Polymer Chemistry","volume":" 36","pages":" 4188-4198"},"PeriodicalIF":4.1000,"publicationDate":"2023-08-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Polymer Chemistry","FirstCategoryId":"92","ListUrlMain":"https://pubs.rsc.org/en/content/articlelanding/2023/py/d3py00755c","RegionNum":2,"RegionCategory":"化学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"POLYMER SCIENCE","Score":null,"Total":0}
引用次数: 0
Abstract
A novel trifluorovinyl-ether (–OCFCF2, TFVE) functionalized diamine (DA-TFVE) with a triarylmethane structure was successfully obtained from renewable vanillin through a Brønsted acidic ionic liquid catalyzed Friedel–Crafts reaction. Subsequently, traditional two-step condensations between DA-TFVE and dianhydride (6FDA and CBDA) were used to prepare two linear polyimides (PI-1 and PI-2, respectively) containing TFVE side groups. Both polyimides exhibited excellent film-forming ability and good solubility in common organic solvents. Upon heating, the linear polyimides could be transformed into cross-linked polyimides (cPI-1 and cPI-2) with perfluorocyclobutyl (PFCB) ether linkers through thermal [2π + 2π] post-polymerization of TFVE groups. Surprisingly, both cPI-1 and cPI-2 exhibited high mechanical strength with a storage modulus of more than 2.0 GPa at room temperature, as well as outstanding thermal stability with glass transition temperatures of 402 °C and 374 °C, respectively. The polymer films before and after thermal crosslinking showed high transparency. In particular, a transmittance of 73% at 450 nm and 81% at 500 nm was observed for the colorless polyimide PI-2 with aliphatic segments. X-ray diffraction results of the obtained PIs showed that the average inter-chain distances (d-spacing) were 0.44–0.59 nm, indicating the hindered chain packing caused by PFCB linkers between the polymer chains. All these results suggested their potential application as candidate materials in high-performance packaging and flexible electronics.
期刊介绍:
Polymer Chemistry welcomes submissions in all areas of polymer science that have a strong focus on macromolecular chemistry. Manuscripts may cover a broad range of fields, yet no direct application focus is required.