The electrical insulation characteristics of a glass adhesive process for the silicon mems element of a pressure sensor

IF 1.4 4区材料科学 Q3 MATERIALS SCIENCE, CERAMICS

Journal of Ceramic Processing Research Pub Date : 2020-01-01 DOI:10.36410/JCPR.2020.21.S1.S81

Gon-Jae Lee, D. Choi

引用次数: 0

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压力传感器硅mems元件的玻璃粘接工艺的电绝缘特性

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Journal of Ceramic Processing Research 工程技术-材料科学：硅酸盐

CiteScore

2.00

自引率

69.20%

发文量

审稿时长

8 months

期刊介绍： The JOURNAL OF CERAMIC PROCESSING RESEARCH aims to publish original research articles covering the influence of processing routes on the microstructure and properties of ceramics and ceramic-based materials. The journal is managed by Hanyang University Press and overseen by an in-house editorial team of professional editors for a rigorous peer-review process with rapid publication.