SEMICONDUCTOR PROPERTIES OF THE PASSIVE FILM FORMED ON Ni201 IN NEUTRAL SOLUTION

IF 2.9 2区 材料科学 Q2 METALLURGY & METALLURGICAL ENGINEERING
Tan Yu, Li Ke-xin, Zhang Qing-han
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引用次数: 1

Abstract

The semiconductor properties of the passive film on Ni201 formed by anodic passivation in pH=8.4 buffer solution and the oxide film on Ni201 formed by thermally grown in air at 500℃ were investigated by photoelectrochemical response and Mott-Schottky response analysis.The Mott-Schottky plots for both the passive film and the thermal oxide film on Ni201 demonstrated that the two films exhibited p-type semiconductors with different values of flat band potential:0.40 V for the passive film and 0.15 V for the thermally grown NiO.The photocurrent spectra of the passive film on Ni201 were derived into two peaks for inner NiO and outer Ni(OH)_2 layers,respectively.The band gap energy E_g for the inner NiO was 2.8 eV and the E_g for outer Ni(OH)_2 was 1.6 eV,respectively.The E_g of the inner NiO of the passive film on Ni201(2.8 eV) was closed to that of the thermally grown oxide of Ni201(2.4 eV),indicating that the inner NiO in the passive film is crystalline structure.An electronic energy band model of both p-type semiconductors of inner NiO and outer Ni(OH)_2 layers was proposed to explain the photocurrent and Mott-Schottky plots for the passive film on Ni201.
Ni201在中性溶液中形成的钝化膜的半导体特性
采用光电化学响应和Mott-Schottky响应分析研究了在pH=8.4的缓冲溶液中阳极钝化Ni201的钝化膜和在500℃空气中热生长Ni201的氧化膜的半导体性能。对Ni201上的钝化氧化膜和热氧化膜的Mott-Schottky图表明,两种膜均表现出具有不同平带电位值的p型半导体:钝化氧化膜为0.40 V,热氧化NiO为0.15 V。Ni201表面钝化膜的光电流谱分别为NiO层和Ni(OH)_2层的两个峰。内部NiO的能带能为2.8 eV,外部Ni(OH)_2的能带能为1.6 eV。Ni201(2.8 eV)上钝化膜内部NiO的E_g与Ni201热生长氧化物(2.4 eV)的E_g接近,表明钝化膜内部NiO为结晶结构。提出了Ni(OH)_2层和Ni(OH)_2层p型半导体的电子能带模型来解释Ni201上钝化膜的光电流和Mott-Schottky图。
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来源期刊
Acta Metallurgica Sinica-English Letters
Acta Metallurgica Sinica-English Letters METALLURGY & METALLURGICAL ENGINEERING-
CiteScore
6.60
自引率
14.30%
发文量
122
审稿时长
2 months
期刊介绍: This international journal presents compact reports of significant, original and timely research reflecting progress in metallurgy, materials science and engineering, including materials physics, physical metallurgy, and process metallurgy.
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