A Technological Approach for Miniaturization of Three-Dimensional Inductive Levitation Microsuspensions

IF 1.1 4区 物理与天体物理 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC
Emil R. Mamleyev;Achim Voigt;Ali Moazenzadeh;Jan G. Korvink;Manfred Kohl;Kirill Poletkin
{"title":"A Technological Approach for Miniaturization of Three-Dimensional Inductive Levitation Microsuspensions","authors":"Emil R. Mamleyev;Achim Voigt;Ali Moazenzadeh;Jan G. Korvink;Manfred Kohl;Kirill Poletkin","doi":"10.1109/LMAG.2022.3174522","DOIUrl":null,"url":null,"abstract":"In this letter, we report on a technological approach for miniaturization of a inductive levitating microsuspension based on nested three-dimensional (3-D) microcoil structures. In the developed approach, each 3-D microcoil is fabricated separately, beginning with the innermost and thus the smallest coil diameter of the nested microstructure. This helps to overcome fabrication restrictions due to the wire-bonding process and is primarily caused by the size of the bond-head and provides the opportunity to fabricate smaller nested 3-D microcoil structures. We fabricated a nested two-microcoil structure, the inner coil having a diameter of 1000 \n<inline-formula><tex-math>$\\mu$</tex-math></inline-formula>\nm and 14 windings, the outer coil with a diameter of 1900 \n<inline-formula><tex-math>$\\mu$</tex-math></inline-formula>\nm and eight windings, and demonstrated its application as an inductive levitating microsuspension. In particular, a fabricated 3-D inductive levitating microsuspension was able to levitate a 1100 \n<inline-formula><tex-math>$\\mu$</tex-math></inline-formula>\nm diameter disc-shaped proof mass at a height up to 45 \n<inline-formula><tex-math>$\\mu$</tex-math></inline-formula>\nm.","PeriodicalId":13040,"journal":{"name":"IEEE Magnetics Letters","volume":"13 ","pages":"1-4"},"PeriodicalIF":1.1000,"publicationDate":"2022-03-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/iel7/5165412/9656771/09772963.pdf","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Magnetics Letters","FirstCategoryId":"101","ListUrlMain":"https://ieeexplore.ieee.org/document/9772963/","RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
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Abstract

In this letter, we report on a technological approach for miniaturization of a inductive levitating microsuspension based on nested three-dimensional (3-D) microcoil structures. In the developed approach, each 3-D microcoil is fabricated separately, beginning with the innermost and thus the smallest coil diameter of the nested microstructure. This helps to overcome fabrication restrictions due to the wire-bonding process and is primarily caused by the size of the bond-head and provides the opportunity to fabricate smaller nested 3-D microcoil structures. We fabricated a nested two-microcoil structure, the inner coil having a diameter of 1000 $\mu$ m and 14 windings, the outer coil with a diameter of 1900 $\mu$ m and eight windings, and demonstrated its application as an inductive levitating microsuspension. In particular, a fabricated 3-D inductive levitating microsuspension was able to levitate a 1100 $\mu$ m diameter disc-shaped proof mass at a height up to 45 $\mu$ m.
三维诱导悬浮微悬浮液小型化的技术途径
在这封信中,我们报道了一种基于嵌套三维(3-D)微线圈结构的感应悬浮微悬架的小型化技术方法。在所开发的方法中,每个三维微线圈都是单独制造的,从嵌套微结构的最内层开始,因此是最小的线圈直径。这有助于克服由引线键合工艺引起的制造限制,并且主要由键合头的尺寸引起,并且提供了制造更小的嵌套3-D微线圈结构的机会。我们制作了一个嵌套的两个微线圈结构,内部线圈直径为1000$\mu$m,有14个绕组,外部线圈直径为1900$\mu$m,有8个绕组,并展示了其作为感应悬浮微悬浮的应用。特别地,制造的三维感应悬浮微悬浮液能够将直径1100$\mu$m的圆盘形检验质量悬浮在高达45$\mu$m的高度。
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来源期刊
IEEE Magnetics Letters
IEEE Magnetics Letters PHYSICS, APPLIED-
CiteScore
2.40
自引率
0.00%
发文量
37
期刊介绍: IEEE Magnetics Letters is a peer-reviewed, archival journal covering the physics and engineering of magnetism, magnetic materials, applied magnetics, design and application of magnetic devices, bio-magnetics, magneto-electronics, and spin electronics. IEEE Magnetics Letters publishes short, scholarly articles of substantial current interest. IEEE Magnetics Letters is a hybrid Open Access (OA) journal. For a fee, authors have the option making their articles freely available to all, including non-subscribers. OA articles are identified as Open Access.
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