Powder Preparation in Aerosol Deposition Method for Lead Zirconate Titanate Thick Films

IF 1.7 4区物理与天体物理 Q3 PHYSICS, APPLIED

Japanese Journal of Applied Physics Pub Date : 2002-11-30 DOI:10.1143/JJAP.41.6980

J. Akedo, M. Lebedev

引用次数: 77

Abstract

The influence of a pre-process for a starting powder in the deposition of ferroelectric thick films using the aerosol deposition method (ADM) was investigated. When a dry-milling procedure was introduced to the preparation of the ferroelectric powder, the deposition rate of ADM increased significantly up to 30-fold and reached 73 µm/min for a 5 mm2 area. However, density and electrical properties of the thick film decreased. If heat treatment at 800°C for 4 h was additionally introduced to the pre-process of the starting powder, the deposition rate increased up to 7–10-fold as compared with that for a starting powder and the electrical properties were improved from Pr=20 µC/cm2 at Ec=50 kV/cm to 32 µC/cm2 at Ec=45 kV/cm.

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气溶胶沉积法制备锆钛酸铅厚膜粉末

研究了初始粉末预处理工艺对气溶胶沉积法沉积铁电厚膜的影响。当采用干磨工艺制备铁电粉末时，ADM的沉积速率显著提高了30倍，达到73µm/min，面积为5 mm2。然而，厚膜的密度和电性能下降。如果在启动粉末的预处理过程中增加800℃热处理4 h，沉积速率比启动粉末提高了7 - 10倍，电性能从Ec=50 kV/cm时的Pr=20µC/cm2提高到Ec=45 kV/cm时的32µC/cm2。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Japanese Journal of Applied Physics 物理-物理：应用

CiteScore

3.00

自引率

26.70%

发文量

818

审稿时长

3.5 months

期刊介绍： The Japanese Journal of Applied Physics (JJAP) is an international journal for the advancement and dissemination of knowledge in all fields of applied physics. JJAP is a sister journal of the Applied Physics Express (APEX) and is published by IOP Publishing Ltd on behalf of the Japan Society of Applied Physics (JSAP). JJAP publishes articles that significantly contribute to the advancements in the applications of physical principles as well as in the understanding of physics in view of particular applications in mind. Subjects covered by JJAP include the following fields: • Semiconductors, dielectrics, and organic materials • Photonics, quantum electronics, optics, and spectroscopy • Spintronics, superconductivity, and strongly correlated materials • Device physics including quantum information processing • Physics-based circuits and systems • Nanoscale science and technology • Crystal growth, surfaces, interfaces, thin films, and bulk materials • Plasmas, applied atomic and molecular physics, and applied nuclear physics • Device processing, fabrication and measurement technologies, and instrumentation • Cross-disciplinary areas such as bioelectronics/photonics, biosensing, environmental/energy technologies, and MEMS