Viability of Cryogenic Cooling to Reduce Processor Power Consumption

IF 2.2 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Alec Nordlund, M. Harrison, J. Gess
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Abstract

Through the application of cryogenic cooling via liquid nitrogen (LN2), the power consumption of a CPU was substantially reduced. Using a digitally controlled solenoid valve and an additively manufactured cold plate, the manual process of LN2 cooling was automated for precise control of cold plate temperature. The power consumption and frequency relationship of the processor were established across three different thermal solutions to demonstrate the effect of temperature on this relationship. It was found that power consumption of the processor decreased at lower temperatures due to a reduction in current leakage and the core voltage necessary for stable operation. This culminated in a reduction of up to 10.7% in processor power consumption for the automated solution and 21.5% for the manual LN2 solution when compared to the air-cooled baseline. Due to the binary nature of the solenoid valve used, flow rate was tuned via an in-line needle valve to increase thermal stability. It was found that for lower flow rates, approximately 5.0 g/s, temperatures oscillated within a range of ±11.5 °C while for higher flow rates of 10–12 g/s, generated amplitudes are as small as ±3.5 °C. Additionally, several tests measured the rate of LN2 consumption and found that the automated solution used 230%–280% more coolant than the manual thermal solution, implying there is room for improvement in the cold plate geometry, LN2 vapor exhaust design, and coolant delivery optimization.
低温冷却降低处理器功耗的可行性
通过液氮(LN2)低温冷却的应用,CPU的功耗大大降低。采用数控电磁阀和增材制造的冷板,实现了人工LN2冷却过程的自动化,实现了冷板温度的精确控制。在三种不同的散热方案下建立了处理器的功耗和频率关系,以证明温度对这种关系的影响。研究发现,在较低的温度下,由于电流泄漏和稳定运行所需的核心电压减少,处理器的功耗降低。与风冷基准相比,自动化解决方案的处理器功耗降低了10.7%,手动LN2解决方案的处理器功耗降低了21.5%。由于所使用的电磁阀的二元特性,通过在线针阀调节流量,以提高热稳定性。研究发现,当流量较低时,约为5.0 g/s,温度在±11.5°C范围内振荡,而当流量较大时(10-12 g/s),产生的振幅小至±3.5°C。此外,几项测试测量了LN2的消耗率,发现自动解决方案使用的冷却剂比手动热解决方案多230%-280%,这意味着在冷板几何形状、LN2蒸汽排气设计和冷却剂输送优化方面还有改进的空间。
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来源期刊
Journal of Electronic Packaging
Journal of Electronic Packaging 工程技术-工程:电子与电气
CiteScore
4.90
自引率
6.20%
发文量
44
审稿时长
3 months
期刊介绍: The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.
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