Analysis of Several Electromagnetic Band Gap Topologies for Reducing Simultaneous Switching Noise

Y. U. Maheswari, A. Amudha, L. Kumar
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引用次数: 0

Abstract

In the case of high-speed PCB design, the use of electromagnetic band gap (EBG) structure technology is useful in reducing simultaneous switching noise (SSN) in high-frequency applications. In high-frequency processes, parasitic filters are ineffective. Conducted emission is reduced by including the planar EBG structure into PCB plane layers. Various planar structures are taken and simulated in this research, including LC type, Z-Bridge with embedded double square, L-Bridge with slit type, alternating impedance, slit type EBG, Triple square type, and two topology type structures. A frequency sweep of 0 GHz to 10 GHz is used with a FEM solution. Theoretical calculations of the structures are performed and compared to simulation results, which show that they are very similar. Based on the best bandwidth and noise depth, the L-Bridge with slit and Triple square type cases were chosen, constructed, and analyzed using a vector network analyzer; it was discovered that the noise depth and bandwidth are in good accord. In addition, the AC analysis-Electric Field distribution for power and ground planes is explored, and the maximum and minimum field levels may be understood as a consequence.
几种降低同时开关噪声的电磁带隙拓扑分析
在高速PCB设计的情况下,使用电磁带隙(EBG)结构技术有助于降低高频应用中的同步开关噪声(SSN)。在高频过程中,寄生滤波器是无效的。通过在PCB平面层中加入平面EBG结构,减少了传导发射。本研究选取并模拟了多种平面结构,包括LC型、嵌双方z型桥、狭缝型l型桥、交流阻抗型、狭缝型EBG、三方型EBG和两种拓扑型结构。0 GHz至10 GHz的频率扫描与FEM解决方案一起使用。对结构进行了理论计算,并与仿真结果进行了比较,结果表明两者非常相似。基于最佳带宽和噪声深度,选择、构造了狭缝型和三方形型l桥,并利用矢量网络分析仪对其进行了分析;结果表明,噪声深度和带宽基本一致。此外,还探讨了交流分析-电源和地平面的电场分布,从而可以理解最大和最小电场水平。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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CiteScore
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