Squeeze film air damping in MEMS

IF 5.1 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

Sensors and Actuators A-physical Pub Date : 2007-05-01 Epub Date: 2007-01-16 DOI:10.1016/j.sna.2007.01.008

Minhang Bao , Heng Yang

引用次数: 679

Abstract

The paper presents an overview and reports the recent progress of research on squeeze film air damping in MEMS. The review starts with the governing equations of squeeze film air damping: the nonlinear isothermal Reynolds equation and various reduced forms of the equation for different conditions. After the basic effects of squeeze film damping on the dynamic performances of micro-structures are discussed based on the analytical solutions to parallel plate problems, recent research on various aspects of squeeze film air damping are reviewed, including the squeeze film air damping of perforated and slotted plate, the squeeze film air damping in rarefied air and the squeeze film air damping of torsion mirrors. Finally, the simulation of squeeze film air damping is reviewed. For quick reference, important equations and curves are included.

查看原文本刊更多论文

MEMS中的挤压膜空气阻尼

本文综述并报告了MEMS中挤压膜空气阻尼的最新研究进展。本文首先介绍了挤压膜空气阻尼的控制方程:非线性等温雷诺方程和不同条件下的各种简化形式。在平行板问题解析解的基础上，讨论了挤压膜阻尼对微结构动力性能的基本影响，综述了近年来挤压膜空气阻尼各方面的研究进展，包括多孔和开槽板的挤压膜空气阻尼、稀薄空气中的挤压膜空气阻尼和扭力镜的挤压膜空气阻尼。最后对挤压膜空气阻尼的仿真进行了综述。为了快速参考，包括了重要的方程和曲线。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

Sensors and Actuators A-physical 工程技术-工程：电子与电气

CiteScore

8.10

自引率

6.50%

发文量

630

审稿时长

49 days

期刊介绍： Sensors and Actuators A: Physical brings together multidisciplinary interests in one journal entirely devoted to disseminating information on all aspects of research and development of solid-state devices for transducing physical signals. Sensors and Actuators A: Physical regularly publishes original papers, letters to the Editors and from time to time invited review articles within the following device areas: • Fundamentals and Physics, such as: classification of effects, physical effects, measurement theory, modelling of sensors, measurement standards, measurement errors, units and constants, time and frequency measurement. Modeling papers should bring new modeling techniques to the field and be supported by experimental results. • Materials and their Processing, such as: piezoelectric materials, polymers, metal oxides, III-V and II-VI semiconductors, thick and thin films, optical glass fibres, amorphous, polycrystalline and monocrystalline silicon. • Optoelectronic sensors, such as: photovoltaic diodes, photoconductors, photodiodes, phototransistors, positron-sensitive photodetectors, optoisolators, photodiode arrays, charge-coupled devices, light-emitting diodes, injection lasers and liquid-crystal displays. • Mechanical sensors, such as: metallic, thin-film and semiconductor strain gauges, diffused silicon pressure sensors, silicon accelerometers, solid-state displacement transducers, piezo junction devices, piezoelectric field-effect transducers (PiFETs), tunnel-diode strain sensors, surface acoustic wave devices, silicon micromechanical switches, solid-state flow meters and electronic flow controllers. Etc...