A smart power transistor for high voltage inverter applications

IF 1.9 3区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Rupprecht Gabriel
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引用次数: 1

Abstract

Motors, lighting equipment and power supplied benefit from high voltage smart power integrated circuits. Limitations of standard isolation techniques in respect of reverse operation in inductive load applications, i.e. high dV/dt load, cause standard isolation techniques to fail in these applications. Dielectric isolation techniques are overcoming these problems. This paper describes a new concept for high voltage power integrated circuits using silicon on insulator (SOI) technology in high voltage smart power transistors.

SOI technology enables the integration of vertical power transistors and smart power features such as gate drive, overcurrent and overtemperature shutdown circuitry. Using dielectric isolation techniques, virtually all power transistor families and integrated circuits technologies can be merged. The benefits and limitations of this technology are discussed in connection with a high voltage smart power MOS transistor and an IGBT using SOI technology.

一种用于高压逆变器应用的智能功率晶体管
电机,照明设备和电源供应受益于高压智能电源集成电路。在电感负载应用中,即高dV/dt负载的反向操作方面,标准隔离技术的局限性导致标准隔离技术在这些应用中失败。电介质隔离技术正在克服这些问题。本文介绍了在高压智能功率晶体管中采用绝缘体上硅(SOI)技术的高压功率集成电路的新概念。SOI技术可集成垂直功率晶体管和智能电源功能,如栅极驱动、过流和过温关断电路。使用介电隔离技术,几乎所有的功率晶体管家族和集成电路技术可以合并。结合高压智能功率MOS晶体管和采用SOI技术的IGBT,讨论了该技术的优点和局限性。
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来源期刊
Microelectronics Journal
Microelectronics Journal 工程技术-工程:电子与电气
CiteScore
4.00
自引率
27.30%
发文量
222
审稿时长
43 days
期刊介绍: Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems. The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc. Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.
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