Cyclopentadienyl Precursors for the Atomic Layer Deposition of Erbium Oxide Thin Films†

Timothee Blanquart, Mikko Kaipio, Jaakko Niinistö, Marco Gavagnin, Valentino Longo, Laurie Blanquart, Clement Lansalot, W. Noh, Heinz D. Wanzenböck, Mikko Ritala, Markku Leskelä
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引用次数: 8

Abstract

In this article, three novel cyclopentadienyl precursors are evaluated for the atomic layer deposition (ALD) of erbium oxide, with either ozone or water as the oxygen source. The erbium precursors evaluated are Er(iPrCp)3, Er(MeCp)2(iPr-amd), and Er(nBuCp)3. The films are deposited on silicon within the temperature range 200–400°C. Self-limiting growth is achieved with all three precursors, with both ozone and water. It is found that the water processes of all three precursors present significantly higher growth rates when compared to the ozone processes. An up to three-fold increase in the growth rate is observed for the water processes of Er(iPrCp)3 and Er(MeCp)2(iPr-amd) (amd: amidinate) when compared to their ozone processes. The films are smooth and uniform, as determined by atomic force microscopy (AFM) (rms roughness < 3% of film thickness). The composition of the films is investigated by means of X-ray photoelectron spectroscopy (XPS). It is found that the films contain small amounts of carbon as an impurity, especially in the case of ozone-processed films. Using Er(nBuCp)3 together with ozone as the oxygen source, a highly conformal Er2O3 thin film is deposited on a 1:60 high-aspect-ratio substrate. This is the first report of the conformal growth of Er2O3 thin films by ALD on a high-aspect-ratio structure.

氧化铒薄膜原子层沉积的环戊二烯基前驱体
本文以臭氧或水为氧源,研究了三种新型环戊二烯基前驱体用于氧化铒的原子层沉积(ALD)。评价的铒前体是Er(iPrCp)3、Er(MeCp)2(iPr-amd)和Er(nBuCp)3。薄膜在200-400°C的温度范围内沉积在硅上。臭氧和水这三种前体都能实现自我限制的生长。研究发现,与臭氧过程相比,所有三种前体的水过程都表现出明显更高的增长率。与臭氧过程相比,观察到Er(iPrCp)3和Er(MeCp)2(iPr-amd) (amd:氨基甲酸)的水过程的生长速度增加了三倍。通过原子力显微镜(AFM)测定(均方根粗糙度为膜厚的3%),膜光滑均匀。用x射线光电子能谱(XPS)研究了膜的组成。发现薄膜中含有少量的碳作为杂质,特别是在臭氧处理的薄膜中。利用Er(nBuCp)3和臭氧作为氧源,在1:60的高宽高比衬底上沉积了高适形的Er2O3薄膜。这是首次报道用ALD在高纵横比结构上生长Er2O3薄膜的适形生长。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Chemical Vapor Deposition
Chemical Vapor Deposition 工程技术-材料科学:膜
自引率
0.00%
发文量
0
审稿时长
>12 weeks
期刊介绍: Chemical Vapor Deposition (CVD) publishes Reviews, Short Communications, and Full Papers on all aspects of chemical vapor deposition and related technologies, along with other articles presenting opinion, news, conference information, and book reviews. All papers are peer-reviewed. The journal provides a unified forum for chemists, physicists, and engineers whose publications on chemical vapor deposition have in the past been spread over journals covering inorganic chemistry, materials chemistry, organometallics, applied physics and semiconductor technology, thin films, and ceramic processing.
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