Luminescent Properties of Multilayered Eu2O3 and TiO2 Grown by Atomic Layer Deposition**

Per-Anders Hansen, Helmer Fjellvåg, Terje G. Finstad, Ola Nilsen
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引用次数: 13

Abstract

Atomic layer deposition (ALD) is used to control the interatomic interactions of Eu and Ti in multilayered structures, as measured by characterizing the luminescent properties of the deposited material. Luminescent multilayer structures of Eu2O3 and TiO2 are deposited as thin films by ALD at 300 °C using Eu(thd)3/O3 and TiCl4/H2O (thd = 2,2,6,6-tetramethyl-3,5-heptanedione) as precursor systems. The individual layer thickness of the multilayered structure is produced from first N ALD cycles Eu2O3 and then N ALD cycles TiO2 (N = 1 to 50), while the total film thickness is kept constant. The thinnest distinct layers are detected for N = 10, where each layer is measured to be less than 0.4 nm thick. The as-deposited films are smooth (root mean square (rms) roughness < 0.4 nm) and amorphous, independent of the layer thickness, N. The refractive index and extinction coefficient are also independent of N, while the luminescence efficiency is constant for N up to 10 cycles, and decreases for thicker superlayers. Annealing deteriorates the layered structures, causing a decrease in luminescence efficiency for thin superlayers, while thick superlayers increase in efficiency upon annealing. The films are characterized by spectroscopic ellipsometry (SE), photoluminescence (PL), X-ray diffraction (XRD), X-ray fluorescence (XRF), X-ray reflectivity (XRR), and atomic force microscopy (AFM).

Abstract Image

原子层沉积法制备Eu2O3和TiO2多层材料的发光性能**
原子层沉积(ALD)用于控制Eu和Ti在多层结构中的原子间相互作用,通过表征沉积材料的发光特性来测量。以Eu(thd)3/O3和TiCl4/H2O (thd = 2,2,6,6-四甲基-3,5-庚烷二酮)为前驱体,在300°C下ALD沉积Eu2O3和TiO2的发光多层结构薄膜。在总膜厚保持不变的情况下,先对Eu2O3进行N次ALD循环,再对TiO2进行N次ALD循环(N = 1 ~ 50),得到多层结构的各层厚度。当N = 10时,检测到最薄的不同层,其中每层的厚度小于0.4 nm。沉积薄膜光滑(均方根粗糙度为0.4 nm)且非晶化,与层厚N无关,折射率和消光系数也与N无关,而发光效率在N下保持恒定(10个周期),越厚的超层越低。退火使层状结构恶化,导致薄超层的发光效率降低,而厚超层的发光效率在退火后提高。采用椭偏光谱(SE)、光致发光(PL)、x射线衍射(XRD)、x射线荧光(XRF)、x射线反射率(XRR)和原子力显微镜(AFM)对薄膜进行了表征。
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来源期刊
Chemical Vapor Deposition
Chemical Vapor Deposition 工程技术-材料科学:膜
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审稿时长
>12 weeks
期刊介绍: Chemical Vapor Deposition (CVD) publishes Reviews, Short Communications, and Full Papers on all aspects of chemical vapor deposition and related technologies, along with other articles presenting opinion, news, conference information, and book reviews. All papers are peer-reviewed. The journal provides a unified forum for chemists, physicists, and engineers whose publications on chemical vapor deposition have in the past been spread over journals covering inorganic chemistry, materials chemistry, organometallics, applied physics and semiconductor technology, thin films, and ceramic processing.
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