Guest Editorial: High-performance polyimide dielectric materials

IF 3.8 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Jun-Wei Zha, Lei Zhai
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Moreover, polyimides can be compounded with various functional fillers to achieve the multifunctional dielectric materials with low or high dielectric properties, low dielectric loss and high breakdown strength. Polyimide dielectric materials also have an ease of processability that make them patternable for many types of integrated devices. With the ongoing advancements in a wide range of novel electronic, microelectronic and new energy applications, polyimide dielectric materials have gained increasing interest from both fundamental and applied research. High-performance polyimide dielectric materials are essential for the development of new electronic or electrical devices where further considerations are required, including higher temperature resistance and energy storage, lower dielectric constant and dielectric loss, improved thermal conduction management as well as better reliability or flexibility in harsh environments. In order to meet the more stringent application requirements mentioned above, there is an urgent need to develop polyimide dielectric materials with higher comprehensive performance, which requires joint development through new theoretical designs, new structures, methods, processes and other means. A wide variety of research is being conducted to prepare kinds of functional polyimide dielectric materials to address applicable challenges and explore possible opportunities in different fields. This current Special Issue is focused on ‘<b><i>High performance polyimide dielectric materials</i></b>’ and their applications in different topics, emphasising the latest innovations in polyimide or polyimide-based dielectric materials and better understanding of deep relationship between their chemical or composition structures and overall performances.</p><p>In this Special Issue, four high-quality papers have undergone peer-reviewed and eventually been accepted for publication. These published papers include five original research papers and one review article in the application field of high-performance polyimide dielectric materials. All the papers can be clustered into three main categories related to dielectric materials, namely preparation, molecular design and measurement or simulation. (1) The first category of paper offers simple and effective strategies to prepare crosslinked polyimide aerogel with a microporous structure and functional fluorinated graphene/polyimide (FG/PI) composites, respectively. The effects of manufacturing process on thermal insulation property or thermal conductivity, as well as permittivity and electrical insulating performance, are well studied. The papers in this category is of Qiu L and Zha J W et al., (2) The second category of paper exhibits novelties in the molecular design of high-performance polyimide dielectrics with significant enhancement of dielectric properties. Some special polyimides containing functional structures or groups are designed and synthesised, such as PIS series with siloxane segments in the main chain and SPI series with sulfonyl groups in the side chain. This paper is of Tong H and Li X M et al. (3) The last category proposes new simulation and measurement methods for polyimide nanocomposite dielectrics or polyimide films, rendering them suitable for high-temperature energy storage and flexible solar wing applications. An energy storage and release model considering the charge trapping effects is constructed and electrical properties as well as stress-strain characteristics of films under different tensile stresses are respectively analysed in detail. These papers are of Min D M et al., Qin S C and Zhang J W et al. A brief presentation of each of the paper in this special issue follows.</p><p><span>Qiu L and Zha J W et al.</span> present a freeze-drying strategy combined with regulation of microstructure to prepare a series of crosslinked polyimide aerogels by introducing crosslinking agents into a linear structure. The thermodynamic, thermal insulation and dielectric properties are achieved by controlling the rigidity and composition of polymerised monomers. It is proved that the increased rigidity of a molecular structure is beneficial for the formation of denser micro-pores, thus obtaining excellent comprehensive properties. This work provides a new pathway to construct polyimide aerogels with ultralow permittivity and good thermal insulating, promoting a wider application in the field of integrated circuits or aerospace exploration.</p><p><span>Tong H and Li X M et al.</span> designed and synthesised a kind of novel diamine with sulfonyl-containing side chain. The corresponding polyimide dielectrics (SPI) were further prepared to investigate the influence of the polar side chain on dielectric and energy storage properties. Moreover, molecular simulation was adopted to analyse the correlation relationships of molecular structure, microscopic parameters and properties. It is found that the introduction of the strong polar sulfonyl group in the side chain can effectively enhance dielectric and energy storage properties, and the dipolar moment density calculated from molecular simulation is closely correlated to permittivity measured from experiments. This work offers an effective combined method of molecular simulation and experiments to assist in the molecular design of high-performance polyimide dielectrics.</p><p><span>Min D M et al.</span> introduce an energy storage and release model that is constructed after considering the charge trapping effects and simulate the high-temperature energy storage and release properties of polyimide nanocomposite dielectrics with different charge injection barriers and trap parameters at 150℃. A triangular voltage is applied to the electrodes at both sides of the polyimide nanocomposite dielectrics. The electric displacement-electric field loop is simulated, and the discharged energy densities and energy efficiencies are calculated. It is found that increasing the charge injection barrier, deep trap energy and deep trap density can effectively reduce the charge injection and carrier mobility, thereby improving the discharged energy densities and energy efficiencies of dielectric capacitors. 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引用次数: 0

Abstract

Polyimides are advanced polymeric materials that are well known for their excellent thermal, mechanical, electrical and chemical resistance properties. As an important kind of high-temperature resistant dielectric material, polyimides have been widely used in various applications such as electronics, microelectronics and electrical fields, due to their high thermal stability, high glass transition temperature (Tg), outstanding dielectric and electrical insulating performance at the high electric field or at high frequencies. Polyimide dielectric materials have a rich variety of reactive monomers, which endows the molecular structures with strong designability and facilitates the regulation of material properties. Moreover, polyimides can be compounded with various functional fillers to achieve the multifunctional dielectric materials with low or high dielectric properties, low dielectric loss and high breakdown strength. Polyimide dielectric materials also have an ease of processability that make them patternable for many types of integrated devices. With the ongoing advancements in a wide range of novel electronic, microelectronic and new energy applications, polyimide dielectric materials have gained increasing interest from both fundamental and applied research. High-performance polyimide dielectric materials are essential for the development of new electronic or electrical devices where further considerations are required, including higher temperature resistance and energy storage, lower dielectric constant and dielectric loss, improved thermal conduction management as well as better reliability or flexibility in harsh environments. In order to meet the more stringent application requirements mentioned above, there is an urgent need to develop polyimide dielectric materials with higher comprehensive performance, which requires joint development through new theoretical designs, new structures, methods, processes and other means. A wide variety of research is being conducted to prepare kinds of functional polyimide dielectric materials to address applicable challenges and explore possible opportunities in different fields. This current Special Issue is focused on ‘High performance polyimide dielectric materials’ and their applications in different topics, emphasising the latest innovations in polyimide or polyimide-based dielectric materials and better understanding of deep relationship between their chemical or composition structures and overall performances.

In this Special Issue, four high-quality papers have undergone peer-reviewed and eventually been accepted for publication. These published papers include five original research papers and one review article in the application field of high-performance polyimide dielectric materials. All the papers can be clustered into three main categories related to dielectric materials, namely preparation, molecular design and measurement or simulation. (1) The first category of paper offers simple and effective strategies to prepare crosslinked polyimide aerogel with a microporous structure and functional fluorinated graphene/polyimide (FG/PI) composites, respectively. The effects of manufacturing process on thermal insulation property or thermal conductivity, as well as permittivity and electrical insulating performance, are well studied. The papers in this category is of Qiu L and Zha J W et al., (2) The second category of paper exhibits novelties in the molecular design of high-performance polyimide dielectrics with significant enhancement of dielectric properties. Some special polyimides containing functional structures or groups are designed and synthesised, such as PIS series with siloxane segments in the main chain and SPI series with sulfonyl groups in the side chain. This paper is of Tong H and Li X M et al. (3) The last category proposes new simulation and measurement methods for polyimide nanocomposite dielectrics or polyimide films, rendering them suitable for high-temperature energy storage and flexible solar wing applications. An energy storage and release model considering the charge trapping effects is constructed and electrical properties as well as stress-strain characteristics of films under different tensile stresses are respectively analysed in detail. These papers are of Min D M et al., Qin S C and Zhang J W et al. A brief presentation of each of the paper in this special issue follows.

Qiu L and Zha J W et al. present a freeze-drying strategy combined with regulation of microstructure to prepare a series of crosslinked polyimide aerogels by introducing crosslinking agents into a linear structure. The thermodynamic, thermal insulation and dielectric properties are achieved by controlling the rigidity and composition of polymerised monomers. It is proved that the increased rigidity of a molecular structure is beneficial for the formation of denser micro-pores, thus obtaining excellent comprehensive properties. This work provides a new pathway to construct polyimide aerogels with ultralow permittivity and good thermal insulating, promoting a wider application in the field of integrated circuits or aerospace exploration.

Tong H and Li X M et al. designed and synthesised a kind of novel diamine with sulfonyl-containing side chain. The corresponding polyimide dielectrics (SPI) were further prepared to investigate the influence of the polar side chain on dielectric and energy storage properties. Moreover, molecular simulation was adopted to analyse the correlation relationships of molecular structure, microscopic parameters and properties. It is found that the introduction of the strong polar sulfonyl group in the side chain can effectively enhance dielectric and energy storage properties, and the dipolar moment density calculated from molecular simulation is closely correlated to permittivity measured from experiments. This work offers an effective combined method of molecular simulation and experiments to assist in the molecular design of high-performance polyimide dielectrics.

Min D M et al. introduce an energy storage and release model that is constructed after considering the charge trapping effects and simulate the high-temperature energy storage and release properties of polyimide nanocomposite dielectrics with different charge injection barriers and trap parameters at 150℃. A triangular voltage is applied to the electrodes at both sides of the polyimide nanocomposite dielectrics. The electric displacement-electric field loop is simulated, and the discharged energy densities and energy efficiencies are calculated. It is found that increasing the charge injection barrier, deep trap energy and deep trap density can effectively reduce the charge injection and carrier mobility, thereby improving the discharged energy densities and energy efficiencies of dielectric capacitors. This work provides a theoretical and model support for the improvement of the high-temperature energy storage performance of nanocomposites in the fields of aerospace or pulse power.

Qin S C and Zhang J W et al. explore measurement methods of electrical properties and stress-strain characteristics under different tensile stresses for polyimide films applied in flexible solar wings. The polyimide films used in flexible solar wings are subjected to irradiation in space and tensile mechanical stress, which makes the charge accumulation effect and results to electrostatic discharge. To solve this problem, it is necessary to establish a test method for charge transport and accumulation characteristics of polyimide under tensile stress. The mechanical properties of polyimide films under tensile stress were investigated experimentally, and a model for predicting the film thickness was developed using the micro-element method. Finally, a method for conducting conductivity measurements under tension was further discussed. This work provides a basis for investigating the electrical conductivity mechanism and stress-strain characteristics of polyimide films under different tensile stresses, thus promoting the formulation selection and performance improvement of polyimide for flexible solar wings of spacecraft.

All of the papers selected for this Special Issue fully display that polyimide or polyimide-based dielectric materials with high performance are significantly moving forward. The demand for innovative and diverse polyimide materials with superior thermal, mechanical, electrical insulating and dielectric properties has greatly increased, and related research has attracted more and more attention. The study of relationship between structures, fabrication and performance of polyimide dielectric materials is the focus of basic research in the future. Meantime, it is urgent to develop relevant measurement methods, theoretical analyses and multiscale modelling. The application research of polyimide dielectric materials in the fields of high-temperature energy storage, high-frequency communication, advanced electronics or microelectronics needs to make breakthrough progress.

客座编辑:高性能聚酰亚胺介电材料
聚酰亚胺是一种先进的聚合物材料,以其优异的耐热性、机械性、电气性和耐化学性而闻名。聚酰亚胺作为一种重要的耐高温介电材料,由于其高的热稳定性、高的玻璃化转变温度(Tg)、在高电场或高频下优异的介电和电绝缘性能,已被广泛应用于电子、微电子和电气领域。聚酰亚胺介电材料具有丰富的反应性单体,赋予分子结构较强的可设计性,有利于调节材料性能。此外,聚酰亚胺可以与各种功能填料复合,以获得具有低或高介电性能、低介电损耗和高击穿强度的多功能介电材料。聚酰亚胺介电材料还具有易加工性,这使得它们可用于许多类型的集成器件。随着各种新型电子、微电子和新能源应用的不断进步,聚酰亚胺介电材料在基础研究和应用研究中都引起了越来越多的兴趣。高性能聚酰亚胺介电材料对于开发需要进一步考虑的新型电子或电气设备至关重要,包括更高的耐温性和储能性、更低的介电常数和介电损耗、改进的热传导管理以及在恶劣环境中更好的可靠性或灵活性。为了满足上述更严格的应用要求,迫切需要开发综合性能更高的聚酰亚胺介电材料,这需要通过新的理论设计、新的结构、新的方法、新的工艺等手段共同开发。目前正在进行各种各样的研究来制备各种功能聚酰亚胺介电材料,以应对不同领域的适用挑战并探索可能的机会。本期特刊聚焦于“高性能聚酰亚胺介电材料”及其在不同主题中的应用,强调聚酰亚胺或聚酰亚胺基介电材料的最新创新,并更好地理解其化学或组成结构与整体性能之间的深层关系。在本期特刊中,四篇高质量的论文经过了同行评审,最终被接受发表。这些已发表的论文包括5篇高性能聚酰亚胺介电材料应用领域的原创研究论文和1篇综述文章。所有的论文可以分为与介电材料相关的三大类,即制备、分子设计和测量或模拟。(1) 第一类论文分别提供了制备具有微孔结构的交联聚酰亚胺气凝胶和功能性氟化石墨烯/聚酰亚胺(FG/PI)复合材料的简单有效的策略。研究了制造工艺对热绝缘性能或热导率以及介电常数和电绝缘性能的影响。这一类的论文是邱和查等。,(2) 第二类论文展示了高性能聚酰亚胺电介质分子设计的新颖性,显著提高了介电性能。设计和合成了一些含有功能结构或基团的特殊聚酰亚胺,如主链上有硅氧烷链段的PIS系列和侧链上有磺酰基的SPI系列。本文由佟和李等撰写。(3) 最后一类提出了聚酰亚胺纳米复合电介质或聚酰亚胺薄膜的新模拟和测量方法,使其适用于高温储能和柔性太阳能翼应用。建立了考虑电荷捕获效应的储能和释放模型,分别详细分析了薄膜在不同拉应力下的电学性能和应力-应变特性。这些论文是Min DM等人。,秦,张等。以下是本期特刊中每一篇论文的简要介绍。邱和查等。提出了一种结合微观结构调控的冷冻干燥策略,通过将交联剂引入线性结构来制备一系列交联聚酰亚胺气凝胶。热力学、隔热和介电性能是通过控制聚合单体的刚性和组成来实现的。事实证明,分子结构刚性的增加有利于形成更致密的微孔,从而获得优异的综合性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
IET Nanodielectrics
IET Nanodielectrics Materials Science-Materials Chemistry
CiteScore
5.60
自引率
3.70%
发文量
7
审稿时长
21 weeks
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