Compact hybrid eighth-mode substrate integrated waveguide and microstrip line filters with mixed electric and magnetic coupling

IF 1.1 4区 计算机科学 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC
Xiang Wang, Qian-Wen Liu, Xian-Long Yang, Huangyan Li, Xiao-Wei Zhu, Wen Wu
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Abstract

This paper proposes a new type of hybrid eighth-mode substrate integrated waveguide (EMSIW) and microstrip line (MSL) bandpass filter (BPF) with mixed electric and magnetic coupling. Firstly, two second-order EMSIW BPFs with mixed coupling and wide stopband performance are investigated. Then, in order to realise high-order BPF with decent performance, half-wavelength (λ/2) open-circuited MSL resonators are employed in the hybrid BPFs design. In the end, two third-order BPFs and a fourth-order BPF are developed by combining the EMSIW and MSL resonators together. Extra transmission zeros can be introduced due to the cross couplings in the trisection and quadruplet topologies. For demonstration, the proposed prototypes are designed, fabricated and measured. Reasonable agreements can be achieved between the measurement and simulation. The proposed third-order BPFs compete against the state of the art, exhibiting the competitive characteristics of the operating bandwidth, physical footprint and upper-stopband rejection with less order. The proposed fourth-order BPF features a compact size of 0.34 × 0.34λ0, a low insertion loss of 1 dB, a broad 3-dB fractional bandwidth of 22.9% and an excellent lower-stopband suppression.

Abstract Image

具有混合电耦合和磁耦合的紧凑混合八模衬底集成波导和微带线滤波器
本文提出了一种新型的混合电磁耦合八模基片集成波导(EMSIW)和微带线(MSL)带通滤波器(BPF)。首先,研究了两种具有混合耦合和宽阻带性能的二阶EMSIW BPF。然后,为了实现性能良好的高阶BPF,在混合BPF的设计中采用了半波长(λ/2)开路MSL谐振器。最后,通过将EMSIW和MSL谐振器组合在一起,开发了两个三阶BPF和一个四阶BPF。由于三段和四段拓扑中的交叉耦合,可以引入额外的传输零点。为了进行演示,对所提出的原型进行了设计、制造和测量。测量和模拟之间可以达成合理的一致性。所提出的三阶BPF与现有技术相竞争,表现出工作带宽、物理占地面积和上阻带抑制的竞争特性。所提出的四阶BPF具有0.34×0.34λ0的紧凑尺寸、1dB的低插入损耗、22.9%的宽3dB分数带宽和出色的低阻带抑制。
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来源期刊
Iet Microwaves Antennas & Propagation
Iet Microwaves Antennas & Propagation 工程技术-电信学
CiteScore
4.30
自引率
5.90%
发文量
109
审稿时长
7 months
期刊介绍: Topics include, but are not limited to: Microwave circuits including RF, microwave and millimetre-wave amplifiers, oscillators, switches, mixers and other components implemented in monolithic, hybrid, multi-chip module and other technologies. Papers on passive components may describe transmission-line and waveguide components, including filters, multiplexers, resonators, ferrite and garnet devices. For applications, papers can describe microwave sub-systems for use in communications, radar, aerospace, instrumentation, industrial and medical applications. Microwave linear and non-linear measurement techniques. Antenna topics including designed and prototyped antennas for operation at all frequencies; multiband antennas, antenna measurement techniques and systems, antenna analysis and design, aperture antenna arrays, adaptive antennas, printed and wire antennas, microstrip, reconfigurable, conformal and integrated antennas. Computational electromagnetics and synthesis of antenna structures including phased arrays and antenna design algorithms. Radiowave propagation at all frequencies and environments. Current Special Issue. Call for papers: Metrology for 5G Technologies - https://digital-library.theiet.org/files/IET_MAP_CFP_M5GT_SI2.pdf
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