{"title":"Reliably Reinforcing Ball Grid Arrays While Minimizing Stress on Solder Joints","authors":"Markus Schindler","doi":"10.1007/s35784-023-0919-8","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":100026,"journal":{"name":"adhesion ADHESIVES + SEALANTS","volume":"20 2","pages":"12 - 17"},"PeriodicalIF":0.0000,"publicationDate":"2023-05-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://link.springer.com/content/pdf/10.1007/s35784-023-0919-8.pdf","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"adhesion ADHESIVES + SEALANTS","FirstCategoryId":"1085","ListUrlMain":"https://link.springer.com/article/10.1007/s35784-023-0919-8","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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