{"title":"Multiscale EMC Modeling, Simulation, and Validation of a Synchronous Step-Down DC-DC Converter","authors":"Rajen Murugan;Jie Chen;Ambreesh Tripathi;Bibhu Prasad Nayak;Harikiran Muniganti;Dipanjan Gope","doi":"10.1109/JMMCT.2023.3276358","DOIUrl":null,"url":null,"abstract":"The proliferation of power electronics in automotive and industrial applications raises compliance challenges in meeting electromagnetic compatibility (EMC) regulatory standards. In this work, we develop a robust multiscale system-level modeling and simulation methodology for predicting CISPR 25 conducted emission (CE) and radiated emission (RE). The method is based on a novel two-stage process. In the first stage, the IC model is generated either by non-linear time-domain simulation using a device-level physics model or oscilloscope measurements if a prototype is available. In the second stage, the IC model waveforms are used in a simulation environment comprising 3D full-wave frequency domain analysis and specially prepared macro-models for the laboratory equipment. Silicon validation of CISPR 25 EMC measurements on a “low-EMI,” high-performance DCDC automotive/industrial synchronous step-down converter is presented to validate the integrity of the predictive modeling methodology. Good correlations between modeling and EMC-certified testing laboratory emission measurements are achieved (i.e., within +/- 3 dBuV for CE and +/- 6 dBuV for RE). As a result, the predictive EMC modeling methodology can be implemented, early in the design cycle, to ensure first-pass EMC-compliant design.","PeriodicalId":52176,"journal":{"name":"IEEE Journal on Multiscale and Multiphysics Computational Techniques","volume":"8 ","pages":"269-280"},"PeriodicalIF":1.8000,"publicationDate":"2023-06-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Journal on Multiscale and Multiphysics Computational Techniques","FirstCategoryId":"1085","ListUrlMain":"https://ieeexplore.ieee.org/document/10144433/","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 2
Abstract
The proliferation of power electronics in automotive and industrial applications raises compliance challenges in meeting electromagnetic compatibility (EMC) regulatory standards. In this work, we develop a robust multiscale system-level modeling and simulation methodology for predicting CISPR 25 conducted emission (CE) and radiated emission (RE). The method is based on a novel two-stage process. In the first stage, the IC model is generated either by non-linear time-domain simulation using a device-level physics model or oscilloscope measurements if a prototype is available. In the second stage, the IC model waveforms are used in a simulation environment comprising 3D full-wave frequency domain analysis and specially prepared macro-models for the laboratory equipment. Silicon validation of CISPR 25 EMC measurements on a “low-EMI,” high-performance DCDC automotive/industrial synchronous step-down converter is presented to validate the integrity of the predictive modeling methodology. Good correlations between modeling and EMC-certified testing laboratory emission measurements are achieved (i.e., within +/- 3 dBuV for CE and +/- 6 dBuV for RE). As a result, the predictive EMC modeling methodology can be implemented, early in the design cycle, to ensure first-pass EMC-compliant design.