Facile and direct 3D printing of smart glove for gesture monitoring

IF 2.6 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Zaiwei Zhou , Wanli Zhang , Yue Zhang , Xiangyu Yin , Xin-Yuan Chen , Bingwei He
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引用次数: 0

Abstract

The distinctive characteristics of electrically conductive fabrics, including their flexibility, breathability, and comfort, have led to their recognition as a viable substitute for silicon wafers in wearable electronics. However, the difficulty of constructing sensors with three-dimensional (3D) structure on woven fabrics significantly limits their sensitivity and sensing range. Layer-by-layer 3D printing of entire smart textile sensing components has enabled the development of high-performance sensors with enhanced sensitivity and sensing range. This research endeavors to produce a smart glove with superior performance by incorporating strain and pressure sensors by 3D printing a composite conductive ink, consisting of multi-walled carbon nanotubes (MWCNTs), graphene nanosheets (GNSs), fumed silica (FSiO2) and Ecoflex, and encapsulated ink directly onto a commercially available fabric glove. The 3D structure of the sensing layer and the sensing material were intentionally designed to achieve desired performance. The smart glove demonstrates a high gauge factor (GF ∼ 35) and a strain range of 0–50% for strain detection. Additionally, it exhibits a high sensitivity of ∼0.07 kPa−1 and a sensing range of 1000 kPa for pressure examination, which facilitates precise detection of finger bending angles and fingertip contact pressures. The smart glove also shows excellent linearity, repeatable resistance response, favorable cycling characteristics in both strain and pressure detecting, and were unaffected by temperature and humidity. The combination of the smart glove with a Long Short-Term Memory (LSTM) deep learning model achieves a high accuracy (100%) for dynamic gesture recognition and manipulator control, demonstrating their potential for smart wearable electronics and human-computer interaction.

Abstract Image

简单直接的3D打印用于手势监控的智能手套
导电织物的独特特性,包括其灵活性、透气性和舒适性,使其被公认为可穿戴电子产品中硅片的可行替代品。然而,在机织物上构建具有三维(3D)结构的传感器的困难极大地限制了它们的灵敏度和传感范围。整个智能纺织品传感组件的逐层3D打印使高性能传感器的开发具有更高的灵敏度和传感范围。这项研究试图通过3D打印由多壁碳纳米管(MWCNTs)、石墨烯纳米片(GNSs)、气相二氧化硅(FSiO2)和Ecoflex组成的复合导电油墨,并将油墨直接封装在商用织物手套上,从而结合应变和压力传感器,生产出性能优异的智能手套。感测层和感测材料的3D结构被有意设计为实现期望的性能。智能手套具有高应变系数(GF~35),应变检测的应变范围为0~50%。此外,它还具有~0.07 kPa−1的高灵敏度和1000 kPa的压力检测传感范围,有助于精确检测手指弯曲角度和指尖接触压力。智能手套还显示出优异的线性、可重复的电阻响应、良好的应变和压力检测循环特性,并且不受温度和湿度的影响。智能手套与长短期记忆(LSTM)深度学习模型的结合实现了动态手势识别和机械手控制的高精度(100%),展示了其在智能穿戴电子和人机交互方面的潜力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Microelectronic Engineering
Microelectronic Engineering 工程技术-工程:电子与电气
CiteScore
5.30
自引率
4.30%
发文量
131
审稿时长
29 days
期刊介绍: Microelectronic Engineering is the premier nanoprocessing, and nanotechnology journal focusing on fabrication of electronic, photonic, bioelectronic, electromechanic and fluidic devices and systems, and their applications in the broad areas of electronics, photonics, energy, life sciences, and environment. It covers also the expanding interdisciplinary field of "more than Moore" and "beyond Moore" integrated nanoelectronics / photonics and micro-/nano-/bio-systems. Through its unique mixture of peer-reviewed articles, reviews, accelerated publications, short and Technical notes, and the latest research news on key developments, Microelectronic Engineering provides comprehensive coverage of this exciting, interdisciplinary and dynamic new field for researchers in academia and professionals in industry.
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