{"title":"Adjusting the viscosity of silver nanowire ink for promoting the uniformity and conductivity of transparent electrode","authors":"Shanyong Chen, Kaiyang Zhang, Kai Yang, Wei Xiao","doi":"10.1007/s10854-023-10333-w","DOIUrl":null,"url":null,"abstract":"<div><p>In this work, we report a suitable thickening agent (cellulose nanofibril: CNF) to promote the uniformity and conductivity of silver nanowire (AgNW) transparent electrode by increasing the viscosity of AgNW ink. CNF exhibits fascinating characteristics. First, it doesn’t lower the conductivity and transmittance of film. Second, it greatly promotes the dispersity degree of AgNW in ink. Third, it doesn’t affect the ink wetting. Fourth, it increases the ink viscosity and slows the ink flow to solve the problems of disorderly ink flow and ink shrinkage. Finally, it makes the wet film dry uniformly. Hence, CNF greatly promotes the distribution uniformity of AgNW in film. As a result, with the same amount of AgNW, more conductive paths can be constructed in AgNW-CNF film to endow the film with much higher conductivity. Specifically, the sheet resistance, variation coefficient of sheet resistance, transmittance of AgNW film are 38.7 × 10<sup>3</sup> Ω/sq, 40.49%, 90.29%, while those of AgNW-CNF film are 77.5 Ω/sq, 1.59%, 91.89%. Meanwhile, although CNF doesn’t promote the adhesion force, it really greatly promotes the erasion difficulty of AgNW from the substrate. These results demonstrate that CNF and our strategy are effective. In transparent-electrode field, such suitable thickening agent is rare at present.</p></div>","PeriodicalId":646,"journal":{"name":"Journal of Materials Science: Materials in Electronics","volume":"34 11","pages":""},"PeriodicalIF":2.8000,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Materials Science: Materials in Electronics","FirstCategoryId":"5","ListUrlMain":"https://link.springer.com/article/10.1007/s10854-023-10333-w","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
In this work, we report a suitable thickening agent (cellulose nanofibril: CNF) to promote the uniformity and conductivity of silver nanowire (AgNW) transparent electrode by increasing the viscosity of AgNW ink. CNF exhibits fascinating characteristics. First, it doesn’t lower the conductivity and transmittance of film. Second, it greatly promotes the dispersity degree of AgNW in ink. Third, it doesn’t affect the ink wetting. Fourth, it increases the ink viscosity and slows the ink flow to solve the problems of disorderly ink flow and ink shrinkage. Finally, it makes the wet film dry uniformly. Hence, CNF greatly promotes the distribution uniformity of AgNW in film. As a result, with the same amount of AgNW, more conductive paths can be constructed in AgNW-CNF film to endow the film with much higher conductivity. Specifically, the sheet resistance, variation coefficient of sheet resistance, transmittance of AgNW film are 38.7 × 103 Ω/sq, 40.49%, 90.29%, while those of AgNW-CNF film are 77.5 Ω/sq, 1.59%, 91.89%. Meanwhile, although CNF doesn’t promote the adhesion force, it really greatly promotes the erasion difficulty of AgNW from the substrate. These results demonstrate that CNF and our strategy are effective. In transparent-electrode field, such suitable thickening agent is rare at present.
期刊介绍:
The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.