State-of-the-Art and Outlooks of Chiplets Heterogeneous Integration and Hybrid Bonding

Q4 Engineering

Journal of Microelectronics and Electronic Packaging Pub Date : 2021-10-01 DOI:10.4071/imaps.1542066

J. Lau

引用次数: 6

Abstract

In this study, the recent advances and trends of chip-let design and heterogeneous integration packaging will be investigated. Emphasis is placed on the definition, kinds, advantages and disadvantages, lateral interconnects, and examples of chiplet design and heterogeneous integration packaging. Also, emphasis is placed on the fundamental and examples of hybrid bonding.

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芯片异质集成与混合键合的现状与展望

在这项研究中，将研究芯片设计和异构集成封装的最新进展和趋势。重点介绍了小芯片设计和异构集成封装的定义、种类、优缺点、横向互连以及示例。此外，重点介绍了杂化键合的基本原理和实例。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Journal of Microelectronics and Electronic Packaging Engineering-Electrical and Electronic Engineering

CiteScore

1.30

自引率

0.00%

发文量

期刊介绍： The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 4,000 members in the United States and more than 4,000 international members around the world.