Moisture-Resistant Sealing Materials for Downhole HPHT Electrical Feedthrough Package

Q4 Engineering

Journal of Microelectronics and Electronic Packaging Pub Date : 2019-07-01 DOI:10.4071/IMAPS.942864

Hua Xia, N. Settles, David DeWire

{"title":"Moisture-Resistant Sealing Materials for Downhole HPHT Electrical Feedthrough Package","authors":"Hua Xia, N. Settles, David DeWire","doi":"10.4071/IMAPS.942864","DOIUrl":null,"url":null,"abstract":"\n A bismuth oxide–based multicomponent glass system, xH3BO3-yBi2O3-(1-x-y-δ)MO-δ· rare earth oxides (REOs) with MO = TiO2, BaO, ZnO, Fe2O3, etc., and lanthanum series–based REOs, for making downhole high-pressure and high-temperature electrical feedthrough package has been developed using high-temperature melt-quenching and sintering technologies. By properly controlling phase structures in material-manufacturing processes, the obtained sealing materials have shown moisture-resistant properties in their monoclinic and tetragonal mixed phase structures but strongly hydrophobic properties in their covalent bond tetragonal phase. Sealed electrical feedthrough packages have been evaluated under boiling water immersion and 200°C/30,000 PSI water-fluid–simulated downhole harsh environments. The post electrical insulation measurement has demonstrated to be greater than 1.0 × 1014 Ω electrical resistance. This article will show that such a high–bonding strength and high–insulation strength sealing material could be used to seal electrical feed-throughs and connectors for 300°C/30,000 PSI downhole and subsea wireline, logging while drilling, and measurement while drilling tools' signal, data, and electrical power transmissions.","PeriodicalId":35312,"journal":{"name":"Journal of Microelectronics and Electronic Packaging","volume":" ","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2019-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Microelectronics and Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.4071/IMAPS.942864","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"Engineering","Score":null,"Total":0}

引用次数: 1

Abstract

A bismuth oxide–based multicomponent glass system, xH3BO3-yBi2O3-(1-x-y-δ)MO-δ· rare earth oxides (REOs) with MO = TiO2, BaO, ZnO, Fe2O3, etc., and lanthanum series–based REOs, for making downhole high-pressure and high-temperature electrical feedthrough package has been developed using high-temperature melt-quenching and sintering technologies. By properly controlling phase structures in material-manufacturing processes, the obtained sealing materials have shown moisture-resistant properties in their monoclinic and tetragonal mixed phase structures but strongly hydrophobic properties in their covalent bond tetragonal phase. Sealed electrical feedthrough packages have been evaluated under boiling water immersion and 200°C/30,000 PSI water-fluid–simulated downhole harsh environments. The post electrical insulation measurement has demonstrated to be greater than 1.0 × 1014 Ω electrical resistance. This article will show that such a high–bonding strength and high–insulation strength sealing material could be used to seal electrical feed-throughs and connectors for 300°C/30,000 PSI downhole and subsea wireline, logging while drilling, and measurement while drilling tools' signal, data, and electrical power transmissions.

查看原文本刊更多论文

井下高压高压电气馈电封装的防潮密封材料

采用高温熔体淬火和烧结技术，开发了一种用于制造井下高压高温电穿通封装的氧化铋基多组分玻璃系统，即MO=TiO2、BaO、ZnO、Fe2O3等的xH3BO3-yBi2O3-（1-x-y-δ）MO-δ·稀土氧化物（REO）和镧系REO。通过在材料制造过程中适当控制相结构，所获得的密封材料在其单斜和四方混合相结构中显示出防潮性能，但在其共价键四方相中显示出强疏水性能。已在沸水浸泡和200°C/30000 PSI水流体（模拟井下恶劣环境）下对密封的电气馈通包进行了评估。电绝缘后的测量结果表明电阻大于1.0×1014Ω。这篇文章将表明，这种高结合强度和高绝缘强度的密封材料可用于密封300°C/30000 PSI井下和海底电缆、随钻测井以及随钻测量工具的信号、数据和电力传输的电气馈通和连接器。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

Journal of Microelectronics and Electronic Packaging Engineering-Electrical and Electronic Engineering

CiteScore

1.30

自引率

0.00%

发文量

期刊介绍： The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 4,000 members in the United States and more than 4,000 international members around the world.