High aspect-ratio sub-500 nm UV-PDMS bilayer stamps by means of hybrid thermal-ultraviolet curing for resonant nanopillars fabrication through soft UV-NIL

IF 2.6 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Luca Tramarin , Rafael Casquel , Iñigo Mañueco , Miguel Holgado
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Abstract

A novel protocol for the fabrication of bilayer stamps for soft UV-NIL is presented. The patterned layer is composed of a commercially available UV-curable PDMS, while a quartz backplane acts as support layer. The pattern reproduced in the stamp through direct casting comes from a hard template and is composed of nanopillar arrays with 250–300 nm of diameter and 300–400 nm in height. The master template with nanoholes is treated with a self-assembled monolayer before pattern reproduction for improved separation of UV-PDMS layer. The hybrid cross-linking protocol includes a thermal and a UV process, and parameters of the former are investigated for best results. The pattern was reproduced in a resist on a Si sample by means of soft UV-NIL, and the imprinted nanohole arrays show dimensions coherent with the stamp. Finally, its application in the fabrication of resonant nanopillars for sensing purposes is briefly described. This is, to the best of our knowledge, the first time a hybrid thermal-ultraviolet curing of UV-PDMS has been reported and that protruding nanostructures with aspect-ratio higher than 1 in soft UV-NIL stamps have been demonstrated.

Abstract Image

高纵横比(低于500 nm) UV-PDMS双层印花,采用热紫外混合固化,通过软UV-NIL制备共振纳米柱
提出了一种制作软UV-NIL双层印花的新方案。图像化层由市售的uv固化PDMS组成,而石英背板作为支撑层。通过直接铸造在印章中复制的图案来自硬模板,由直径250 - 300nm,高度300 - 400nm的纳米柱阵列组成。在图案复制之前,对带有纳米孔的主模板进行自组装单层处理,以改善UV-PDMS层的分离。混合交联方案包括热和紫外工艺,并对前者的参数进行了研究,以获得最佳效果。利用软UV-NIL在硅样品的抗蚀剂中再现了该图案,印迹的纳米孔阵列显示出与印迹一致的尺寸。最后简要介绍了其在传感用共振纳米柱制造中的应用。据我们所知,这是第一次报道UV-PDMS的混合热紫外固化,并且在软UV-NIL印花中显示了高宽比高于1的突出纳米结构。
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来源期刊
Microelectronic Engineering
Microelectronic Engineering 工程技术-工程:电子与电气
CiteScore
5.30
自引率
4.30%
发文量
131
审稿时长
29 days
期刊介绍: Microelectronic Engineering is the premier nanoprocessing, and nanotechnology journal focusing on fabrication of electronic, photonic, bioelectronic, electromechanic and fluidic devices and systems, and their applications in the broad areas of electronics, photonics, energy, life sciences, and environment. It covers also the expanding interdisciplinary field of "more than Moore" and "beyond Moore" integrated nanoelectronics / photonics and micro-/nano-/bio-systems. Through its unique mixture of peer-reviewed articles, reviews, accelerated publications, short and Technical notes, and the latest research news on key developments, Microelectronic Engineering provides comprehensive coverage of this exciting, interdisciplinary and dynamic new field for researchers in academia and professionals in industry.
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