{"title":"Localized Laser Sintering of Metal Nanoparticle Inks Printed with Aerosol Jet® Technology for Flexible Electronics","authors":"M. Renn, M. Schrandt, J. Renn, James Q. Feng","doi":"10.4071/IMAPS.521797","DOIUrl":null,"url":null,"abstract":"Direct-write methods, such as the Aerosol Jet® technology, have enabled fabrication of flexible multifunctional 3-D devices by printing electronic circuits on thermoplastic and thermoset polymer materials. Conductive traces printed by additive manufacturing typically start in the form of liquid metal nanoparticle inks. To produce functional circuits, the printed metal nanoparticle ink material must be postprocessed to form conductive metal by sintering at elevated temperature. Metal nanoparticles are widely used in conductive inks because they can be sintered at relatively low temperatures compared with the melting temperature of bulk metal. This is desirable for fabricating circuits on low-cost plastic substrates. To minimize thermal damage to the plastics, while effectively sintering the metal nanoparticle inks, we describe a laser sintering process that generates a localized heat-affected zone (HAZ) when scanning over a printed feature. For sintering metal nanoparticles that are reactive to oxygen, an ...","PeriodicalId":35312,"journal":{"name":"Journal of Microelectronics and Electronic Packaging","volume":"14 1","pages":"132-139"},"PeriodicalIF":0.0000,"publicationDate":"2017-12-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"18","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Microelectronics and Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.4071/IMAPS.521797","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"Engineering","Score":null,"Total":0}
引用次数: 18
Abstract
Direct-write methods, such as the Aerosol Jet® technology, have enabled fabrication of flexible multifunctional 3-D devices by printing electronic circuits on thermoplastic and thermoset polymer materials. Conductive traces printed by additive manufacturing typically start in the form of liquid metal nanoparticle inks. To produce functional circuits, the printed metal nanoparticle ink material must be postprocessed to form conductive metal by sintering at elevated temperature. Metal nanoparticles are widely used in conductive inks because they can be sintered at relatively low temperatures compared with the melting temperature of bulk metal. This is desirable for fabricating circuits on low-cost plastic substrates. To minimize thermal damage to the plastics, while effectively sintering the metal nanoparticle inks, we describe a laser sintering process that generates a localized heat-affected zone (HAZ) when scanning over a printed feature. For sintering metal nanoparticles that are reactive to oxygen, an ...
期刊介绍:
The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 4,000 members in the United States and more than 4,000 international members around the world.