Flexible resistive memory device based on agar

IF 2.8 4区 工程技术 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY
Y. Chang, H. Liu, Bo-Jhang Chen
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引用次数: 0

Abstract

Potential applications of natural materials in environmentally friendly electronics include for information storage. In this work, natural material–agar was used to fabricate a flexible resistive memory device. Agar is one of the most widely used biomaterials for tissue engineering, medicine and other biotechnological applications. Agar is a suitable material for flexible electronics due to its good film formation, biocompatibility, low-temperature solution processability, transparency and flexibility. The flexible agar memory device described in this article exhibits an ON/OFF ratio of 103 under a bending radius of 5 mm, good bending endurance and a stable data retention time of over 104 s. Moreover, the agar could easily use a leaf as a substrate to make a fully biodegradable device. Agar, due to its exceptional flexibility, is emerging as a promising candidate for wearable and skin-compatible electronics, particularly in memory devices.
基于琼脂的柔性电阻存储器
天然材料在环境友好型电子产品中的潜在应用包括信息存储。本研究采用天然材料琼脂制备了一种柔性电阻式记忆器件。琼脂是组织工程、医学和其他生物技术应用中应用最广泛的生物材料之一。琼脂具有良好的成膜性、生物相容性、低温溶液可加工性、透明性和柔韧性,是柔性电子器件的理想材料。本文所述的柔性琼脂存储器件在弯曲半径为5mm时的ON/OFF比为103,具有良好的弯曲耐久性和超过104 s的稳定数据保留时间。此外,琼脂可以很容易地使用树叶作为衬底,使一个完全可生物降解的装置。由于其特殊的灵活性,琼脂正在成为可穿戴和皮肤兼容电子产品的有前途的候选者,特别是在存储设备中。
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来源期刊
Flexible and Printed Electronics
Flexible and Printed Electronics MATERIALS SCIENCE, MULTIDISCIPLINARY-
CiteScore
4.80
自引率
9.70%
发文量
101
期刊介绍: Flexible and Printed Electronics is a multidisciplinary journal publishing cutting edge research articles on electronics that can be either flexible, plastic, stretchable, conformable or printed. Research related to electronic materials, manufacturing techniques, components or systems which meets any one (or more) of the above criteria is suitable for publication in the journal. Subjects included in the journal range from flexible materials and printing techniques, design or modelling of electrical systems and components, advanced fabrication methods and bioelectronics, to the properties of devices and end user applications.
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