Experimental investigations on the thermal superposition effect of multiple hotspots for embedded microfluidic cooling

IF 6.9 2区工程技术 Q2 ENERGY & FUELS

Applied Thermal Engineering Pub Date : 2022-02-05 DOI:10.1016/j.applthermaleng.2021.117849

Yuxin Ye , Binbin Jiao , Yanmei Kong , Ruiwen Liu , Xiangbin Du , Kunpeng Jia , Shichang Yun , Dapeng Chen

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引用次数: 43

Abstract

With the development of high-performance multi-core microprocessors, the increase in hotspots density poses a severe challenge to chip thermal management. Embedded cooling can improve the cooling performance at the chip level. However, the cooling efficiency will be deteriorated by the interaction of hotspots. This paper proposes the concept of thermal superposition effect based on the relationship between the cooling efficiency of two hotspots and their relative positions. The effective cooling area and superposition area describe the thermal characteristics and interaction of hotspots, and the superposition factor β evaluates the intensity of interaction. By optimizing the superposition factor, the average temperature reduces 22%. Moreover, the factor can predict the average temperature of hotspots within the error under14%. Therefore, the thermal superposition effect and factor β is an effective analysis tool in multi-hotspot cooling, simplifying the analysis process and making it possible to predict and optimize the interaction by experiment and finite element simulation.

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嵌入式微流控冷却多热点热叠加效应的实验研究

随着高性能多核微处理器的发展，热点密度的增加对芯片热管理提出了严峻的挑战。嵌入式冷却可以提高芯片级的冷却性能。但是，热区的相互作用会降低冷却效率。本文根据两个热点的冷却效率与其相对位置的关系，提出了热叠加效应的概念。有效冷却面积和叠加面积描述了热点的热特性和相互作用，叠加因子β评价了相互作用的强度。通过优化叠加因子，平均温度降低22%。该因子预测热点平均温度的误差在14%以内。因此，热叠加效应和β因子是多热点冷却的有效分析工具，简化了分析过程，使通过实验和有限元模拟预测和优化相互作用成为可能。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Applied Thermal Engineering 工程技术-工程：机械

CiteScore

11.30

自引率

15.60%

发文量

1474

审稿时长

57 days

期刊介绍： Applied Thermal Engineering disseminates novel research related to the design, development and demonstration of components, devices, equipment, technologies and systems involving thermal processes for the production, storage, utilization and conservation of energy, with a focus on engineering application. The journal publishes high-quality and high-impact Original Research Articles, Review Articles, Short Communications and Letters to the Editor on cutting-edge innovations in research, and recent advances or issues of interest to the thermal engineering community.