Hybrid Substrates For Heterogeneous Integration

IF 2.2 4区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Journal of Electronic Packaging Pub Date : 2023-07-20 DOI:10.1115/1.4062993

J. Lau, G. Chen, C. Yang, Vincet Teng, A. Peng, J. Huang, N. Liu, Y. Chen, TJ Tseng, Ming Li

引用次数: 1

Abstract

The hybrid substrate (organic interposer + build-up package substrate + solder joints + underfill) of multiple systems and heterogeneous integration is investigated. The organic interposer of the hybrid substrate is fabricated by a fan-out chip-last on a temporary panel with two different kinds of dielectric materials, namely the PID (photoimageable dielectric) and the ABF (Ajinomoto Build-Up Film). These two hybrid substrates are supporting two different chips. The flatness of metal lines of the RDLs (redistribution-layers), the quality of the hybrid substrate after chip-to-hybrid substrate bonding, and the reliability of the solder joints between these two hybrid substrates will be discussed.

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用于异构集成的混合衬底

研究了多系统和异质集成的混合衬底（有机内插层+组装封装衬底+焊点+底部填充）。混合基板的有机中介层是通过在具有两种不同介电材料的临时面板上的扇出芯片来制造的，即PID（可光成像电介质）和ABF（味之素构建膜）。这两个混合基板支持两个不同的芯片。将讨论RDL（再分布层）的金属线的平坦度、芯片到混合基板接合后的混合基板的质量以及这两个混合基板之间的焊点的可靠性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Journal of Electronic Packaging 工程技术-工程：电子与电气

CiteScore

4.90

自引率

6.20%

发文量

审稿时长

3 months

期刊介绍： The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.