Research progress of intrinsic polymer dielectrics with high thermal conductivity

IF 3.8 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Wenying Zhou, Tian Yao, Mengxue Yuan, Yating Yang, Jian Zheng, Jing Liu
{"title":"Research progress of intrinsic polymer dielectrics with high thermal conductivity","authors":"Wenying Zhou,&nbsp;Tian Yao,&nbsp;Mengxue Yuan,&nbsp;Yating Yang,&nbsp;Jian Zheng,&nbsp;Jing Liu","doi":"10.1049/nde2.12052","DOIUrl":null,"url":null,"abstract":"<p>Heat dissipation has become an important challenge and technical bottleneck for the rapid development of high-frequency microelectronic devices and high-voltage electrical equipment. Thus, there is a great urgent need for high-performance intrinsically thermally conductive polymer (ITCP) to realise effective heat dissipation. In recent year, the ITCP has received extensive attention due to excellent overall performances and clear advantages over conventional heat conductive polymer composites. The thermal transport physics and its relation with the multiscale chain conformations in polymers with diverse morphologies are reviewed. Then, the current understanding of how the chemistry of polymers, multiscale chain morphologies and conformations would affect phonon transport and the resulting thermal conductivity (TC) in both amorphous and crystalline polymers to unveil the important chemistry-structure-property relationships is discussed and anaysed. The latest advances in engineering ITCP from oriented fibre to bulk amorphous states for a high TC are summarised. Lastly, the challenges, prospects and outlook of ITCP have been proposed. The authors anticipate that the present paper will spire more fundamental and applied research in the intrinsic polymer dielectrics field to advance scientific understanding and industrial applications.</p>","PeriodicalId":36855,"journal":{"name":"IET Nanodielectrics","volume":"6 4","pages":"165-181"},"PeriodicalIF":3.8000,"publicationDate":"2023-04-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ietresearch.onlinelibrary.wiley.com/doi/epdf/10.1049/nde2.12052","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IET Nanodielectrics","FirstCategoryId":"1085","ListUrlMain":"https://onlinelibrary.wiley.com/doi/10.1049/nde2.12052","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

Abstract

Heat dissipation has become an important challenge and technical bottleneck for the rapid development of high-frequency microelectronic devices and high-voltage electrical equipment. Thus, there is a great urgent need for high-performance intrinsically thermally conductive polymer (ITCP) to realise effective heat dissipation. In recent year, the ITCP has received extensive attention due to excellent overall performances and clear advantages over conventional heat conductive polymer composites. The thermal transport physics and its relation with the multiscale chain conformations in polymers with diverse morphologies are reviewed. Then, the current understanding of how the chemistry of polymers, multiscale chain morphologies and conformations would affect phonon transport and the resulting thermal conductivity (TC) in both amorphous and crystalline polymers to unveil the important chemistry-structure-property relationships is discussed and anaysed. The latest advances in engineering ITCP from oriented fibre to bulk amorphous states for a high TC are summarised. Lastly, the challenges, prospects and outlook of ITCP have been proposed. The authors anticipate that the present paper will spire more fundamental and applied research in the intrinsic polymer dielectrics field to advance scientific understanding and industrial applications.

Abstract Image

高导热本征聚合物电介质的研究进展
散热已成为高频微电子器件和高压电气设备快速发展的重要挑战和技术瓶颈。因此,迫切需要高性能的本质导热聚合物(ITCP)来实现有效的散热。近年来,ITCP因其优异的综合性能和优于传统导热聚合物复合材料的明显优势而受到广泛关注。综述了不同形态聚合物的热传递物理及其与多尺度链构象的关系。然后,对聚合物的化学性质、多尺度链形态和构象如何影响非晶和结晶聚合物中的声子输运和由此产生的导热系数(TC)的现有认识进行了讨论和分析,以揭示重要的化学-结构-性能关系。综述了工程ITCP的最新进展,从定向纤维到体非晶态的高TC。最后,提出了ITCP面临的挑战、发展前景和展望。作者预计,本文将在本征聚合物电介质领域掀起更多的基础和应用研究,以促进科学认识和工业应用。
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来源期刊
IET Nanodielectrics
IET Nanodielectrics Materials Science-Materials Chemistry
CiteScore
5.60
自引率
3.70%
发文量
7
审稿时长
21 weeks
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