Lifetime modelling of solder joints based on accelerated mechanical testing and Finite Element Analysis

Power electronic devices and components Pub Date : 2023-01-01 DOI:10.1016/j.pedc.2023.100034

M. Lederer, A. Kotas, G. Khatibi

引用次数: 0

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基于加速力学试验和有限元分析的焊点寿命建模

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Power electronic devices and components Hardware and Architecture, Electrical and Electronic Engineering, Atomic and Molecular Physics, and Optics, Safety, Risk, Reliability and Quality

CiteScore

2.00

自引率

0.00%

发文量

审稿时长

80 days