{"title":"Thermal Performance Evaluation of a New Close-Coupled Cooling Solution including Cooling Failure Analysis","authors":"M. Sahini, D. Agonafer","doi":"10.4071/IMAPS.528113","DOIUrl":null,"url":null,"abstract":"The objective of this work is to introduce and evaluate a new end-of-aisle cooling design which consists of three cooling configurations. The key objectives of close-coupled cooling are to enable controlled cooling of information technology (IT) equipment, flexible and modular design, and the containment of hot air exhaust from the cold air. The thermal performance of the proposed solution is evaluated using computational fluid dynamics modeling. A computational model of a small size data center room has been developed. The room is modeled to be a hot aisle containment setup, i.e., the hot air exhaust exiting for each row is contained and directed within a specific volume. The cold aisle is separated from the hot aisle by means of banks of heat exchangers (HXs) placed on either side of the containment aisle. Based on the placement of rack fans, the design is divided into three sub-designs—Case 1: passive HXs with rack fan walls; Case 2: active HXs (coupled with fans) with rack fan walls; Case 3: active HX...","PeriodicalId":35312,"journal":{"name":"Journal of Microelectronics and Electronic Packaging","volume":"15 1","pages":"21-34"},"PeriodicalIF":0.0000,"publicationDate":"2018-03-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Microelectronics and Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.4071/IMAPS.528113","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"Engineering","Score":null,"Total":0}
引用次数: 0
Abstract
The objective of this work is to introduce and evaluate a new end-of-aisle cooling design which consists of three cooling configurations. The key objectives of close-coupled cooling are to enable controlled cooling of information technology (IT) equipment, flexible and modular design, and the containment of hot air exhaust from the cold air. The thermal performance of the proposed solution is evaluated using computational fluid dynamics modeling. A computational model of a small size data center room has been developed. The room is modeled to be a hot aisle containment setup, i.e., the hot air exhaust exiting for each row is contained and directed within a specific volume. The cold aisle is separated from the hot aisle by means of banks of heat exchangers (HXs) placed on either side of the containment aisle. Based on the placement of rack fans, the design is divided into three sub-designs—Case 1: passive HXs with rack fan walls; Case 2: active HXs (coupled with fans) with rack fan walls; Case 3: active HX...
期刊介绍:
The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 4,000 members in the United States and more than 4,000 international members around the world.