New approach to spindle thermal extension measuring based on machine vision for the vertical maching centre

IF 1 4区 工程技术 Q4 INSTRUMENTS & INSTRUMENTATION
D. Su, Wanhua Zhao
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引用次数: 1

Abstract

When machine tool spindles are running at a high rotation speed, thermal deformation will be introduced due to the generation of large amounts of heat, and machining accuracy will be influenced as a result, which is a generalized issue in numerous industries. In this paper, a new approach based on machine vision is presented for measurements of spindle thermal error. The measuring system is composed of a Complementary Metal-Oxide-Semiconductor (CMOS) camera, a backlight source and a PC. Images are captured at different rotation angles during end milling process. Meanwhile, the Canny edge detection and Gaussian sub-pixel fitting methods are applied to obtain the bottom edge of the end mill which is then used to calculate the lowest point coordinate of the tool. Finally, thermal extension of the spindle is obtained according to the change of the lowest point at different time steps of the machining process. This method is validated through comparison with experimental results from capacitive displacement sensors. Moreover, spindle thermal extension during the processing can be precisely measured and used for compensation in order to improve machining accuracy through the proposed method.
立式加工中心主轴热伸长测量的机器视觉新方法
当机床主轴以高转速运行时,由于产生大量热量,会产生热变形,从而影响加工精度,这是许多行业普遍存在的问题。本文提出了一种基于机器视觉的主轴热误差测量新方法。测量系统由一个互补金属氧化物半导体(CMOS)相机、一个背光源和一台PC组成。在端铣过程中,在不同的旋转角度下拍摄图像。同时,应用Canny边缘检测和高斯亚像素拟合方法获得立铣刀的底部边缘,然后用于计算刀具的最低点坐标。最后,根据加工过程中不同时间步长的最低点的变化,获得主轴的热伸长。通过与电容式位移传感器实验结果的比较,验证了该方法的有效性。此外,通过该方法可以精确测量加工过程中的主轴热伸长并进行补偿,以提高加工精度。
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来源期刊
Metrology and Measurement Systems
Metrology and Measurement Systems INSTRUMENTS & INSTRUMENTATION-
CiteScore
2.00
自引率
10.00%
发文量
0
审稿时长
6 months
期刊介绍: Contributions are invited on all aspects of the research, development and applications of the measurement science and technology. The list of topics covered includes: theory and general principles of measurement; measurement of physical, chemical and biological quantities; medical measurements; sensors and transducers; measurement data acquisition; measurement signal transmission; processing and data analysis; measurement systems and embedded systems; design, manufacture and evaluation of instruments. The average publication cycle is 6 months.
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