Thermal Stability of Intermetallic Cu–Sn Interconnections for High Temperature Applications

Q4 Engineering

Journal of Microelectronics and Electronic Packaging Pub Date : 2018-03-26 DOI:10.4071/IMAPS.529384

A. Novikov, M. Nowottnick

引用次数: 0

Abstract

New technology based on mixing of standard alloy SnCu in form of solder paste with copper paste was presented. This technology allows the production of solder joints with higher standoff consisting of intermetallic compounds. Such solder joints were qualified for high temperature applications by investigation of thermal stability of overlapped solder joints. For this purpose a special test bench for the investigation of remelting temperature up to 300°C was developed.

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高温应用中金属间Cu–Sn互连的热稳定性

提出了一种以锡膏形式将标准合金SnCu与铜膏混合的新技术。该技术允许生产由金属间化合物组成的具有更高间距的焊点。通过对重叠焊点的热稳定性的研究，这种焊点适合高温应用。为此，开发了一个专门的试验台，用于研究高达300°C的重熔温度。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Journal of Microelectronics and Electronic Packaging Engineering-Electrical and Electronic Engineering

CiteScore

1.30

自引率

0.00%

发文量

期刊介绍： The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 4,000 members in the United States and more than 4,000 international members around the world.